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Edge647 Schematic ( PDF Datasheet ) - Semtech

Teilenummer Edge647
Beschreibung Pin Electronics Driver/ Window Comparator/ and Switch Matrix
Hersteller Semtech
Logo Semtech Logo 




Gesamt 13 Seiten
Edge647 Datasheet, Funktion
EDGE HIGH-PERFORMANCE PRODUCTS
Description
Edge647
Pin Electronics Driver, Window
Comparator, and Switch Matrix
Applications
The Edge647 is an integrated trinary driver, window • Low Cost Automatic Test Equipment
comparator, and switch matrix pin electronics solution
manufactured in a wide voltage CMOS process. It is
designed for automatic test equipment and
instrumentation where cost, functional density, and power
are all at a premium.
The tristatable driver is capable of generating 3 levels -
one for a logic high, one for a logic low, and one for either
a termination voltage or a special programming voltage.
The on-board window comparator effectively determines
whether the DUT is in a high, low, or intermediate state. Functional Block Diagram
The switches are included to allow such functions as PMU,
pull up, and pull down connections.
VH VTT VL
The Edge647 is intended to offer an extremely low leakage,
low cost, low power, small footprint, per pin solution for
100 MHz and below pin electronics applications. It is a
higher performance, pin and functionally compatible
version of the Edge646.
DATA
DATA*
DVR EN
DVR EN*
VTT EN
VTT EN*
SW0
DOUT
Features
• Pin Compatible with the Edge646
• 100 MHz Operation
• 12V I/O Range
• Programmable Output Levels
• Flex In digital Inputs (Technology Independent)
• Three Level Driver
• Extremely Low Leakage Currents (~0 nA)
• Small Footprint (32 Pin, 7 mm X 7 mm,
TQFP Package)
SW0 EN*
SW1
SW1 EN*
SW2
SW2 EN*
VBB
COMPA
HIGH LEVEL
LOW LEVEL
COMPB
LOAD
CVA
VINP
CVB
Revision 2 / October 27, 2000
1
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Edge647 Datasheet, Funktion
Edge647
EDGE HIGH-PERFORMANCE PRODUCTS
Application Information
Power Supplies Decoupling
Latchup Protection
A .1 µF capacitor is recommended between VCC and
VEE.
In addition, solid VCC and VEE planes are recommended
to provide a low inductance path for the power supply
currents. These planes will reduce any inductive supply
drops associated with switching currents on the power
supply pins. If solid planes are not possible, then wide
power busses are preferable.
VH, VL, and VTT Decoupling
The Edge647 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences. VCC
must remain greater than or equal to VDD (external supply
for the digital logic) at all times. Both VCC and VDD must
always be positive (above ground), and VEE must always
be negative (at or below ground).
The three diode configuration shown in Figure 3 should
be used on a once-per-board basis.
As the VH, VL, and VTT inputs are unbuffered and must
supply the driver output current, decoupling capacitors
for these inputs are recommended in proportion to the
amount of output current the application requires. In
general, a surge current of 50 mA (5V swings series
terminated with 50 into a 50transmission line) are
the maximum dynamic output currents the driver should
see. The decoupling capacitors should be able to provide
this current for the duration of the round trip time between
the pin electronics and the DUT, and then recharge
themselves before the next such transition would occur.
Once this condition is satisfied, the VH, VL, and VTT supply
voltages are more responsible for establishing the DC levels
associated with each function and recharging the
capacitors, rather than providing the actual dynamic
currents required to drive the DUT transmission line.
Ideally, VH, VL, and VTT would each have a dedicated
power layer on the PC board for the lowest possible
inductance power supply distribution.
Power Supply Rules
1) VEE All I/O Pins VCC
2) VCC 0V
3) VEE 0V
Power Up Sequencing
VCC
VDD
1N5820 or
Equivalent
VEE
Figure 3.
Power Supply Protection Scheme
gure 5.
Warning: It is extremely important that the voltage on any
device pin does not exceed the range of VEE –0.5V to VCC
+0.5V at any time, either during power up, normal
operation, or during power down. Failure to adhere to this
requirement could result in latchup of the device, which
could be destructive if the system power supplies are
capable of supplying large amounts of current. Even if the
device is not immediately destroyed, the cumulative
damage caused by the stress of repeated latchup may
affect device reliability.
1) VCC (all other inputs @ ground)
2) VEE (all other inputs @ ground)
3) Digital Inputs
Analog Inputs
VH, VL, VTT
2000 Semtech Corp.
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Edge647 pdf, datenblatt
Edge647
EDGE HIGH-PERFORMANCE PRODUCTS
AC Characteristics
Parameter
Driver
Propagation Delay (Note 3)
DATA IN to DOUT
VTT EN to DOUT
DVR EN* to DOUT (Active to HiZ) (Note 5)
DVR EN* to DOUT (HiZ to Active) (Note 5)
DATA to VTT Prop Delay Matching (Note 4)
Symbol
Min
Typ Max Units
4 6 10 ns
5 7 11 ns
5 7 11 ns
5 7 11 ns
-2 +2 ns
Minimum Pulse Width (3V Swing)
4 5 ns
Toggle Rate (Note 6)
DOUT Output Rise/Fall Times (Notes 1, 4)
1V Swing (20% - 80%)
3V Swing (10% - 90%)
5V Swing (10% - 90%)
DOUT Output Overshoot/Undershoot (Notes 1, 4)
(3V Swing (Swing 2% + 50 mV))
Tpd vs. Overdrive (1.8V) (Note 4)
Tpd vs. Tr/Tf @ Digital Inputs (Note 4)
Tpd vs. Frequency (<=100 MHz) (Note 4)
Tpd Rise, Tpd Fall Errors (Note 4)
Comparator
Comparator Digital Outputs (Notes 2, 4)
Rise Time (10% - 90%)
Fall time (10% - 90%)
VINP to COMPA, COMPB
Tpd vs. Frequency (<= 100 MHz) (Note 4)
Minimum Pulse Width
Toggle Rate (Note 6)
Comparator Uncertainty Region (Notes 4, 7)
Tpd vs. Overdrive
400 mV Overdrive
200 mV Overdrive
Tpd Rise, Tpd Fall Errors
Switch Matrix
SW0, 1, 2 EN* to Switch On/Off
Fmax
100
MHz
1.2 1.6 ns
1.0 1.5 2.0 ns
2.0 3.5 ns
110
100
50
200
2.0
mV
ps
ps
ps
ns
tr 1.5 2.5 ns
tf 1.5 2.5 ns
Tpd 5 7 11 ns
200 ps
4 5 ns
Fmax
100
MHz
-25 +25 mV
1.0 ns
2.0 ns
2.0 ns
8 25 60 ns
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Into 1M of 50transmission line terminated with 1Kand 5 pF with the proper series termination
resistor.
LOW LEVEL = 0V, HIGH LEVEL = 3.3V.
Measured at 2.5V with VH = +5V, VL = 0V.
Guaranteed by design and characterization. This parameter is not tested in production.
Tested with a 30 mA load.
Guaranteed by characterization. This parameter is tested in production against 40 MHz limits.
The region around the threshold where the comparator may have difficulty resolving the input state.
2000 Semtech Corp.
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