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Edge646 Schematic ( PDF Datasheet ) - Semtech

Teilenummer Edge646
Beschreibung Pin Electronics Driver/ Window Comparator/ and Switch Matrix
Hersteller Semtech
Logo Semtech Logo 




Gesamt 13 Seiten
Edge646 Datasheet, Funktion
EDGE HIGH-PERFORMANCE PRODUCTS
Description
Edge646
Pin Electronics Driver, Window
Comparator, and Switch Matrix
Applications
The Edge646 is an integrated trinary driver, window • Low Cost Automatic Test Equipment
comparator, and switch matrix pin electronics solution
manufactured in a wide voltage CMOS process. It is
designed for automatic test equipment and
instrumentation where cost, functional density, and power
are all at a premium.
The tristatable driver is capable of generating 3 levels -
one for a logic high, one for a logic low, and one for either
a termination voltage or a special programming voltage.
The on-board window comparator effectively determines
whether the DUT is in a high, low, or intermediate state. Functional Block Diagram
The switches are included to allow such functions as PMU,
pull up, and pull down connections.
The Edge646 is intended to offer an extremely low leakage,
low cost, low power, small footprint, per pin solution for
100 MHz and below pin electronics applications.
DATA
DATA*
DVR EN
DVR EN*
VH VTT VL
DOUT
Features
• 100 MHz Operation
• 12V I/O Range
• Programmable Output Levels
• Flex In digital Inputs (Technology Independent)
• Three Level Driver
• Extremely Low Leakage Currents (~0 nA)
• Small Footprint (32 Pin, 7 mm X 7 mm,
TQFP Package)
VTT EN
VTT EN*
SW0
SW0 EN*
SW1
SW1 EN*
SW2
SW2 EN*
VBB
COMPA
HIGH LEVEL
LOW LEVEL
COMPB
LOAD
CVA
VINP
CVB
Revision 2 /October 27, 2000
1
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Edge646 Datasheet, Funktion
Edge646
EDGE HIGH-PERFORMANCE PRODUCTS
Application Information
PRELIMINARY
Power Supplies Decoupling
Latchup Protection
A .1 µF capacitor is recommended between VCC and
VEE.
In addition, solid VCC and VEE planes are recommended
to provide a low inductance path for the power supply
currents. These planes will reduce any inductive supply
drops associated with swtiching currents on the power
supply pins. If solid planes are not possible, then wide
power busses are preferable.
The Edge646 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences. VCC
must remain greater than or equal to VDD (external supply
for the digital logic) at all times. Both VCC and VDD must
always be positive (above ground), and VEE must always
be negative (at or below ground).
The three diode configuration shown in Figure 3 should
be used on a once-per-board basis.
VH, VL, and VTT Decoupling
As the VH, VL, and VTT inputs are unbuffered and must
supply the driver output current, decoupling capacitors
for these inputs are recommended in proportion to the
amount of output current the application requires. In
general, a surge current of 50 mA (5V swings series
terminated with 50 into a 50 transmission line) are
the maximum dynamic output currents the driver should
see. The decoupling capacitors should be able to provide
this current for the duration of the round trip time between
the pin electronics and the DUT, and then recharge
themselves before the next such transition would occur.
Once this condition is satisfied, the VH, VL, and VTT supply
voltages are more responsible for establishing the DC levels
associated with each function and recharging the
capacitors, rather than providing the actual dynamic
currents required to drive the DUT transmission line.
Ideally, VH, VL, and VTT would each have a dedicated
power layer on the PC board for the lowest possible
inductance power supply distribution.
VCC
VDD
1N5820 or
Equivalent
VEE
Figure 3.
Power Supply Protection Scheme
gure 5.
Warning: It is extremely important that the voltage on any
device pin does not exceed the range of VEE –0.5V to VCC
+0.5V at any time, either during power up, normal
operation, or during power down. Failure to adhere to this
requirement could result in latchup of the device, which
could be destructive if the system power supplies are
capable of supplying large amounts of current. Even if the
device is not immediately destroyed, the cumulative
damage caused by the stress of repeated latchup may
affect device reliability.
2000 Semtech Corp.
6
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Edge646 pdf, datenblatt
Edge646
EDGE HIGH-PERFORMANCE PRODUCTS
AC Characteristics
Parameter
Driver
Propagation Delay (Note 3)
DATA IN to DOUT
VTT EN to DOUT
DVR EN* to DOUT (Active to HiZ ) (Note
5)
DVR EN* to DOUT (HiZ to Active) (Note
5)
DATA to VTT Prop Delay Matching (Note
4)
Minimum Pulse Width (3V Swing)
Toggle Rate (Note 6)
DOUT Output Rise/Fall Times (Notes 1, 4)
1V Swing (20% - 80%)
3V Swing (10% - 90%)
5V Swing (10% - 905)
Comparator
Comparator Digital Outputs (Notes 2, 4)
Rise Time (10% - 90%)
Fall time (10% - 90%)
VINP to COMPA, COMPB
Minimum Pulse Width
Toggle Rate (Note 6)
Tpd vs. Overdrive
400 mV Overdrive
200 mV Overdrive
Tpd Rise, Tpd Fall Errors
Switch Matrix
SW0, 1, 2 EN* to Switch On/Off
Symbol
Fmax
tr
tf
Tpd
Fmax
Min
Typ
Max
Units
7 11
7 11
7 11
7 11
-1.2
4
100
1.2
1.0 1.5
2.0
14 ns
14 ns
14 ns
14 ns
1.2 ns
5 ns
MHz
1.6 ns
2.0 ns
3.5 ns
4
100
1.5
1.5
8
4
10 20
2.5 ns
2.5 ns
11 ns
5 ns
MHz
3.0 ns
5.0 ns
2.0 ns
50 ns
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Into 1M of 50transmission line terminated with 1Kand 5 pF with the proper series termination
resistor.
LOW LEVEL = 0V, HIGH LEVEL = 3.3V.
Measured at 2.5V with VH = +5V, VL = 0V.
Guaranteed by design and characterization. This parameter is not tested in production.
Tested with a 30 mA load.
Guaranteed by characterization. (This parameter is tested in production against 40 MHz limits.)
2000 Semtech Corp.
12
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