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W27L010 Schematic ( PDF Datasheet ) - Winbond

Teilenummer W27L010
Beschreibung 128K 8 ELECTRICALLY ERASABLE EPROM
Hersteller Winbond
Logo Winbond Logo 




Gesamt 14 Seiten
W27L010 Datasheet, Funktion
Preliminary W27L010
128K × 8 ELECTRICALLY ERASABLE EPROM
GENERAL DESCRIPTION
The W27L010 is a high speed, low power consumption Electrically Erasable and Programmable Read
Only Memory organized as 131072 × 8 bits. It requires only one supply in the range of 3.0V to 3.6V in
normal read mode. The W27L010 provides an electrical chip erase function.
FEATURES
High speed access time:
90/120 nS (max.)
Read operating current: 10 mA (max.)
Erase/Programming operating current:
30 mA (max.)
Standby current: 20 µA (max.)
Low voltage power supply range, 3.0V to 3.6V
+14V erase/+12V programming voltage
Fully static operation
All inputs and outputs directly TTL/CMOS
compatible
Three-state outputs
Available packages: 32-pin 600 mil DIP, 450
mil SOP and PLCC
PIN CONFIGURATIONS
Vpp
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
1
2
3
4
5
6
7
8 32-pin DIP
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Vcc
PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
/
AAA V V P
111 p c GN
2 56 p c MC
432 1 33 3
A7 5
2 1 0 29
A6 6
28
A5 7
27
A4 8
26
A3 9 32-pin PLCC 25
A2 10
24
A1 11
23
A0 12 1 1 1 1 1 1 2 22
Q0 13 4 5 6 7 8 9 0 21
Q QGQ QQQ
1 2 N3 4 5 6
D
A14
A13
A8
A9
A11
OE
A10
CE
Q7
BLOCK DIAGRAM
PGM
CE
OE
CONTROL
OUTPUT
BUFFER
Q0
.
.
Q7
A0
.
DECODER
.
A16
VCC
GND
VPP
CORE
ARRAY
PIN DESCRIPTION
SYMBOL
A0A16
Q0Q7
CE
OE
PGM
VPP
VCC
GND
NC
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Enable
Output Enable
Program Enable
Program/Erase Supply Voltage
Power Supply
Ground
No Connection
Publication Release Date: February 1999
- 1 - Revision A1






W27L010 Datasheet, Funktion
Preliminary W27L010
READ OPERATION DC CHARACTERISTICS
(VCC = 3.0V to 3.6V, TA = 0 to 70° C)
PARAMETER
SYM.
CONDITIONS
Input Load Current
Output Leakage Current
Standby VCC Current
(TTL input)
Standby VCC Current
(CMOS input)
VCC Operating Current
ILI
ILO
ISB
ISB1
ICC
VPP Operating Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
VPP Operating Voltage
IPP
VIL
VIH
VOL
VOH
VPP
VIN = 0V to VCC
VOUT = 0V to VCC
CE = VIH
CE = VCC ±0.2V
CE = VIL
IOUT = 0 mA
f = 5 MHz
VPP = VCC
-
-
IOL = 1.6 mA
IOH = -0.1 mA
-
MIN.
-5
-10
-
LIMITS
TYP.
-
-
-
MAX.
5
10
200
UNIT
µA
µA
µA
- - 20 µA
- - 10 mA
- - 10 µA
-0.3 -
0.6 V
2.0 - VCC +0.5 V
- - 0.4 V
2.4 -
-V
VCC -0.7
-
VCC
V
READ OPERATION AC CHARACTERISTICS
(VCC = 3.0V to 3.6V, TA = 0 to 70° C)
PARAMETER
SYM.
W27L010-90
W27L010-12
MAX. MIN. MAX. MIN.
Read Cycle Time
TRC
90 - 120
-
Chip Enable Access Time
TCE - 90 - 120
Address Access Time
TACC
- 90 - 120
Output Enable Access Time
TOE
- 40
-
55
OE High to High-Z Output
TDF
- 25
-
30
Output Hold from Address Change
TOH
0-
0
-
Note: VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.
UNIT
nS
nS
nS
nS
nS
nS
-6-

6 Page









W27L010 pdf, datenblatt
Preliminary W27L010
ORDERING INFORMATION
PART NO.
ACCESS
TIME
(nS)
POWER SUPPLY
CURRENT MAX.
(mA)
STANDBY VCC
CURRENT MAX.
(µA)
PACKAGE
W27L010-90
90
8
20 600 mil DIP
W27L010-12
120
8
20 600 mil DIP
W27L010S-90
90
8
20 450 mil SOP
W27L010S-12
120
8
20 450 mil SOP
W27L010P-90
90
8
20 32-pin PLCC
W27L010P-12
120
8
20 32-pin PLCC
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in
applications where personal injury might occur as a consequence of product failure.
PACKAGE DIMENSIONS
32-pin P-DIP
32
E1
1
S
A A2
L
D
17
B e1
B1
16
A1 Base Plane
Seating Plane
a
E
eA
Dimension in Inches Dimension in mm
Symbol Min. Nom. Max. Min. Nom. Max.
A
0.210
5.33
A 1 0.010
0.25
A 2 0.150 0.155 0.160 3.81 3.94 4.06
B 0.016 0.018 0.022 0.41 0.46 0.56
B 1 0.048 0.050 0.054 1.22 1.27 1.37
c 0.008 0.010 0.014 0.20 0.25 0.36
D
1.650 1.660
41.91 42.16
E 0.590 0.600 0.610 14.99 15.24 15.49
E 1 0.545 0.550 0.555 13.84 13.97 14.10
e 1 0.090 0.100 0.110 2.29 2.54 2.79
L 0.120 0.130 0.140 3.05 3.30 3.56
a0
15 0
15
e A 0.630 0.650 0.670 16.00 16.51 17.02
S
0.085
2.16
Notes:
1. Dimensions D Max. & S include mold flash or tie bar burrs.
c 2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and are
determined at the mold parting line.
4. Dimension B1 does not include dambar protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on final visual
inspection spec.
- 12 -

12 Page





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