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UPC1663G-E1 Schematic ( PDF Datasheet ) - NEC

Teilenummer UPC1663G-E1
Beschreibung DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC
Hersteller NEC
Logo NEC Logo 




Gesamt 16 Seiten
UPC1663G-E1 Datasheet, Funktion
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1663
DC to VHF WIDEBAND DIFFERENTIAL INPUT AND OUTPUT AMPLIFIER IC
DESCRIPTION
The µPC1663 is a differential input, differential output wideband amplifier IC that uses an high frequency silicon
bipolar process. This process improves bandwidth phase characteristics, input noise voltage characteristics, and low
power consumption when compared to conventional HF-band differential amplifier ICs.
These features make this device suitable as a wideband amplifier in high-definition TVs, high-resolution monitors,
broadcasting satellite receivers, and video cameras, as a sense amplifier in high-density CCD and optical pick-up
products, or as a pulse amplifier for optical data links.
These ICs are manufactured using NEC’s 6 GHz fT NESATTM I silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability.
FEATURES
• Bandwidth and typical gain : 120 MHz @ AVOL = 300
700 MHz @ AVOL = 10
• Phase delay
: –85 deg. @ AVOL = 100, 100 MHz
• Input Noise Voltage
• Supply Current
: 3 µVr.m.s. (RS = 50 , 10 k to 10 MHz)
: 13mA TYP. @ VCC± = ±6 V
• Gain adjustable from 10 to 300 with external resistor
• No frequency compensation required (Small phase delay at 10 MHz or less)
ORDERING INFORMATION
Part Number
µPC1663G-E1
Package
8-pin plastic SOP (225 mil)
µPC1663GV-E1 8-pin plastic SSOP (175 mil)
Marking
1663
Supplying Form
Embossed tape 12 mm wide.
Pin 1 is in tape pull-out direction.
Qty 2.5 kp/reel.
Embossed tape 8 mm wide.
Pin 1 is in tape pull-out direction.
Qty 1 kp/reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order:
µPC1663G, µPC1663GV)
Caution µPC1663C (8-pin plastic DIP) is discontinued.
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G11024EJ6V0DS00 (6th edition)
Date Published September 1999 N CP(K)
Printed in Japan
The mark shows major revised points.
©
1987, 1999






UPC1663G-E1 Datasheet, Funktion
µPC1663
TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C)
SINGLE-ENDED VOLTAGE GAIN vs. FREQUENCY
VCC± = ± 6 V
60
50
40
Gain 1
30
20
10 Gain 2
0
100 K
1 M 10 M
Frequency f (Hz)
100 M
Remark Differential voltage gain is double of
single-ended voltage gain.
RELATIVE VOLTAGE GAIN vs. OPERATING
AMBIENT TEMPERATURE
1.4
1.2
1.0 Gain 2
0.8
0.6 Gain 1
0.4
0.2
0.1
±2
±3 ±4 ±5 ±6 ±7
Supply Voltage VCC± (V)
±8
1.05
RELATIVE GAIN vs. OPERATING AMBIENT
TEMPERATURE
VCC±= ±6 V
OUTPUT SINK CURRENT vs. OPERATING
AMBIENT TEMPERATURE
4.0
1.00
Gain 2
3.5
0.95 3.0
Gain 1
0.90
–20 0 +20 +50 +80
Operating Ambient Temperature TA (°C)
2.5
–20
0 +20
VCC± = ±6 V
+50 +80
Operating Ambient Temperature TA (°C)
Remark Relative voltage gains are described based on gains 1.00 at TA = +25°C, VCC± = ±6 V
6 Data Sheet G11024EJ6V0DS00

6 Page









UPC1663G-E1 pdf, datenblatt
µPC1663
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Conditions
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: NoneNote
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: NoneNote
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: NoneNote
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: NoneNote
Recommended Condition Symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
12 Data Sheet G11024EJ6V0DS00

12 Page





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