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PCA1606 Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer PCA1606
Beschreibung 32 kHz watch circuits with EEPROM
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 16 Seiten
PCA1606 Datasheet, Funktion
INTEGRATED CIRCUITS
DATA SHEET
PCA16xx series
32 kHz watch circuits with
EEPROM
Product specification
Supersedes data of 1997 Apr 21
File under Integrated Circuits, IC16
1997 Dec 12






PCA1606 Datasheet, Funktion
Philips Semiconductors
32 kHz watch circuits with EEPROM
Product specification
PCA16xx series
AVAILABLE TYPES
Refer to Fig.4 and to Chapters “Ordering information” and “Functional description and testing”.
SHORT
TYPE
NUMBER
DELIVERY
FORMAT(1)
PERIOD
tT
(s)
1601
1602
1603
1604
1605
1606
1607
U/10
T
U/7
U/10
U/7
U/10
U
1
1
20
5
5
10
5
1608
U
5
1611
1621
1622
1623
1624
U
U/7
U
U
U
1
20
1
20
12
1625
1626
1627
U/7
U
U/7
5
20
20
1628
1629
U
U/7
20
5
PULSE
WIDTH tP
(ms)
7.8
7.8
7.8
7.8
4.8
6.8
5.8
7.8
6.8
4.8
4.8
4.8
3.9
5.8
5.8
5.8
5.8
6.8
SPECIFICATIONS
DRIVE
(%)
EEPROM
BATTERY
EOL
REMARKS
DETECTION
100 yes
no
75 yes no
100 yes
no
75 yes no
75 yes no
100 yes
no
100 yes
75
no 1.5 V and
2.1 V Lithium
100 yes
75
no 1.5 V and
2.1 V Lithium
75 yes no
100 yes
no
100 yes yes
75 yes no
75 yes no 1.5 V and
56 2.1 V Lithium
75 yes no
100 yes
no
100 yes
75
no 1.5 V and
2.1 V Lithium
75 yes no
75 yes no
Note
1. U = Chip in trays; U/7 = chip with bumps on tape; U/10 = chip on foil.
T = SOT144-1.
1997 Dec 12
VM1 - M2
tT
2t T
MSA977
tP
Fig.4 Motor output waveform (normal operation).
6

6 Page









PCA1606 pdf, datenblatt
Philips Semiconductors
32 kHz watch circuits with EEPROM
Product specification
PCA16xx series
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Dec 12
12

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