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PC900V0NSZX Schematic ( PDF Datasheet ) - Sharp Electrionic Components

Teilenummer PC900V0NSZX
Beschreibung DEVICE SPECIFICATION FOR PHOTOCOUPLER
Hersteller Sharp Electrionic Components
Logo Sharp Electrionic Components Logo 




Gesamt 15 Seiten
PC900V0NSZX Datasheet, Funktion
PREPARED BY:
DATE:
SHAR
ELECTRONIC COMPONENTS
GROUP SHARP CORPORATION
SPECIFICATION
I OPTO-ELECTRONIC
-+D=E%VAIn
f DEVICE SPECIFICATION FOR
PHOTOCOUPLER
I MODEL No.
PCSOOV
(Businessdealingname:
PC9OOVONSZXl
1. These specification sheets include materfals protected under copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
-
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlIned
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions menttoned below.
(Precautions)
(1) This product is designed for use in the following application areas ;
l OA equipment * Audio visual equipment
- Telecommunication equipment (Terminal)
i * Tooling machines - Computers
* Home appliances
* Measuring equipment
1
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions gtven in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train. automobile
- Traffic sigmk
* Gas leakage sensor breakers * Rescue and security
[ * Other safety equipment
etc.)
equipment
I
[3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as :
* Space equipment * Telecommunication equipment (for trunk lines)
[ l Nuclear power control equipment
* Medical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
DATE
BY
DATE
PRESENTED
BY
F J-p.
J
/G&‘&&h
IJ, ,+a-3
K. Hachimura,
Department General Manager
Engineering Dept. .I1
Opto-Electronic
Devices Div.
ELECOM Group
SHARP CORPORATION
of






PC900V0NSZX Datasheet, Funktion
SHARP CORPORATION
3.2 Electra-optical characteristics
Parameter
-GIN.
1 TYP. 1 MAX. 1 Unit 1 Conditions -”
Forward voltage
Reverse current
Terminal capacitance
IR
1 - 1 10 1 PA 1 Ta=25%, V,=3V
I-
Ct ( - I30 1250 1 ,,(~;25;,V=O
Operating supply voltage
range
Low level output voltage
vcc 131
-1151vI
_
VOL 1 - 1 0.2 1 0.4 1 v 1 ~&6!&nA,Vcc=5”
High level output current
bH 1 - 1 - 1 100 1 PA 1 g$=l5V
Low level supply current
High level supply current
“H-L” threshold input
current *l
bcL 1 - 1 2.5 1 5.0 1 mA 1 Vcc=5V, 1,=4mA
ECH I - 1 1.0 1 5.0 1 mA 1 Vcc=5”, I,=OmA
“L-H” threshold input
current *2
Hysteresis *3
Isolation resistance
‘FLH /IF,,
Rho
1 0.5 1 0.7 1 0.9 1 - 1 vcc=5v, Iq=280Q
I5XlO’Ol 10” 1 - 1 R ( T$..~ox$OOV
“H-L” propagation time
“L-H” propagation time
Fall time
Rise time
tPHL
t PLH
tf
tr
13
26
- 0.05 0.5
0.1 0.5
Ta=25%
vcc=5v. 1,=4mA
R,=280 0

6 Page









PC900V0NSZX pdf, datenblatt
SHARP CORPORATION
6. Precautions for Soldering Photocouplers
(1) In case of soldering
to lead
260% 10 s or less
Device
temperature
(Cl
180
160
140
120 -
go -
An example of device temperature
vs. soldering time
-0 *- *- e--
.*-
.# ed
Solder
20 - 1 I 1 I
0’0 2’ 4’ 6’ 8 10 12 14 16 18 20
Soldering time (s)
(2) If solder reflow :
It is recommended that only one soldering be done at the temperature
and the time within the temperature profile as shown in the figure below.
230C
18OC
25C
(3) Other precautions
An infrared lamp used to heat up for soldering may cause a localized
temperature rise in the resin. So keep the package temperature within
that specified in Item (2). Also avoid immersing the resin part in the solder.

12 Page





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