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PBYR3045 Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer PBYR3045
Beschreibung Rectifier diodes Schottky barrier
Hersteller NXP Semiconductors
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Gesamt 5 Seiten
PBYR3045 Datasheet, Funktion
Philips Semiconductors
Rectifier diodes
schottky barrier
Product specification
PBYR3045PT series
GENERAL DESCRIPTION
Dual, low leakage, platinum barrier,
schottky rectifier diodes in a plastic
envelope featuring low forward
voltage drop and absence of stored
charge. These devices can withstand
reverse voltage transients and have
guaranteed reverse surge capability.
The devices are intended for use in
switched mode power supplies and
high frequency circuits in general
where low conduction and zero
switching losses are important.
QUICK REFERENCE DATA
SYMBOL PARAMETER
VRRM
VF
IO(AV)
PBYR30-
Repetitive peak reverse
voltage
Forward voltage
Output current (both
diodes conducting)
MAX.
35PT
35
0.60
30
MAX.
40PT
40
0.60
30
MAX.
45PT
45
0.60
30
UNIT
V
V
A
PINNING - SOT93
PIN DESCRIPTION
1 Anode 1 (a)
2 Cathode (k)
3 Anode 2 (a)
tab Cathode (k)
PIN CONFIGURATION
tab
123
SYMBOL
a1 a2
13
k2
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
VRRM
VRWM
VR
IO(AV)
IO(RMS)
IFRM
IFSM
I2t
IRRM
IRSM
Tstg
Tj
Repetitive peak reverse voltage
Crest working reverse voltage
Continuous reverse voltage
Tmb 136 ˚C
Output current (both diodes
conducting)1
RMS forward current
Repetitive peak forward current
per diode
Non-repetitive peak forward
current per diode
I2t for fusing
Repetitive peak reverse current
per diode.
Non-repetitive peak reverse
current per diode.
Storage temperature
Operating junction temperature
square wave; δ = 0.5;
Tmb 130 ˚C
t = 25 µs; δ = 0.5;
Tmb 130 ˚C
t = 10 ms
t = 8.3 ms
sinusoidal Tj = 125 ˚C prior
to surge; with reapplied
VRWM(max)
t = 10 ms
tp = 2 µs; δ = 0.001
tp = 100 µs
-
-
-
-
-
-
-
-
-
-
-
-65
-
MAX.
-35 -40 -45
35 40 45
35 40 45
35 40 45
30
43
30
180
200
162
2
2
175
150
UNIT
V
V
V
A
A
A
A
A
A2s
A
A
˚C
˚C
1 For output currents in excess of 20 A connection should be made to the exposed metal mounting base.
August 1996
1
Rev 1.100





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