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PDF RA1133J Data sheet ( Hoja de datos )

Número de pieza RA1133J
Descripción RA1133J FULL FRAME CCD IMAGE SENSOR
Fabricantes PerkinElmer Optoelectronics 
Logotipo PerkinElmer Optoelectronics Logotipo



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No Preview Available ! RA1133J Hoja de datos, Descripción, Manual

Imaging
Imaging Product Line
RA1133J Full Frame CCD Image Sensor
24 µm square pitch, 1100 x 330 pixel configuration
www.DataSheet4U.com
Description
MPP Operation
The RA1133J is a full frame CCD
sensor with reset capabilities designed
specifically for use in spectroscopy,
biomedical imaging and related scientific
imaging applications. The package for
the array is designed with an integrated
two stage thermoelectric cooler. This
enables the device to be run 40° C
below ambient temperature, -15° C
when compared to room temperature.
Its combination of very low noise and
low dark current make it ideal for low
light, high dynamic range and high
resolution applications.
A major source of dark current in
devices such as this originates in
surface states at the Si-SiO2 interface.
A unigue design and process enables
the RA1133J to be run in "multi-pinned
phase" or MPP mode of operation.
This helps eliminate dark current
generation in the interface surface
states. By holding the vertical clocks
at negative potential during integration
and horizontal signal readout, the
surface will not be depleted and the
surface state will not generate dark
current.
The imager is structured with a single
output register at one end of the imaging
columns. A lateral reset drain is located
adjacent to this readout register which
enables the dumping of accumulated
charge from the array. Two phase clocks
are needed to drive the readout register.
Three phase clocks are needed to drive
imaging cells. The array is available in
a 30-pin metal package with an integrated
TE cooler as shown in Figure 1. Package
dimensions are shown in Figure 8.
Caution: While the RA1133J imagers have been
designed to resist electrostatic discharge (ESD),
they can be damaged from such discharges.
Always observe proper ESD precautions when
handling and storing these sensors.
Features
363,000 picture elements (pixels) in
a 1100 x 330 configuration
24 µm square pixels
2-phase buried channel process
On-chip amplifier for low noise and
high speed readout
Dynamic range greater than 25,000:1
On-chip temperature sensor
Two stage TE cooler integrated into
the package
Hermetically sealed
100% fill factor
10 MHz data rate
www.perkinelmer.com/opto
DSP-303.01C- 8/2002W Page 1

1 page




RA1133J pdf
Full Frame CCD Sensor
Figure 5. Output Structure
VRD
ØRG
VOG
Ø1H ØSG
VDD
Two Stage Amplifier
VSUB
V OUT
VSS VSS
Figure 6. TEC Current vs. Chip Temperature (Ambient Temperature)
Current to Thermo-Electric Cooler, Amp
0 .5 1.0 1.5 2.0 2.5
0
-10
2.3° C/W
Heat Sink
-20
-30
1.8C/W
-40 Heat Sink
-50 1.3 C/W
Heat Sink
-60 .5 C/W
Heat Sink
-70
0 C/W
-80 Heat Sink
Figure 7. Heat Sink Temperature vs. Chip Temperature
Heat Sink Temperature
THot, C
10 20 30 40 50
0
I = .5A
TEC Current
-10
I = 1.1A
TEC Current
-20
I = 2.0A
TEC Current
60
-30
I = 2.5A
TEC Current
-40
-50
www.perkinelmer.com/opto
DSP-303.01C - 8/2002 Page 5

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