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PDF REG113 Data sheet ( Hoja de datos )
| Número de pieza | REG113 | |
| Descripción | DMOS 400mA Low-Dropout Regulator | |
| Fabricantes | Burr-Brown Corporation | |
| Logotipo |  |
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REG113
SBVS031C – MARCH 2001 – REVISED MARCH 2003
DMOS
400mA Low-Dropout Regulator
FEATURES
q CAP-FREE DMOS TOPOLOGY:
Ultra Low Dropout Voltage:
250mV typ at 400mA
Output Capacitor not Required for Stability
q UP TO 500mA PEAK, TYPICAL
q FAST TRANSIENT RESPONSE
q VERY LOW NOISE: 28µVrms
q HIGH ACCURACY: ±1.5% max
q HIGH EFFICIENCY:
IGND = 850µA at IOUT = 400mA
Not Enabled: IGND = 0.01µA
q 2.5V, 2.85V, 3.0V, 3.3V, AND 5.0V OUTPUT VERSIONS
q OTHER OUTPUT VOLTAGES AVAILABLE UPON
REQUEST
q FOLDBACK CURRENT LIMIT
q THERMAL PROTECTION
q SMALL SURFACE-MOUNT PACKAGES:
SOT23-5 and MSOP-8
APPLICATIONS
q PORTABLE COMMUNICATION DEVICES
q BATTERY-POWERED EQUIPMENT
q PERSONAL DIGITAL ASSISTANTS
q MODEMS
q BAR-CODE SCANNERS
q BACKUP POWER SUPPLIES
DESCRIPTION
The REG113 is a family of low-noise, low-dropout linear
regulators with low ground pin current. Its new DMOS topol-
ogy provides significant improvement over previous designs,
including low-dropout voltage (only 250mV typ at full load),
and better transient performance. In addition, no output
capacitor is required for stability, unlike conventional low-
dropout regulators that are difficult to compensate and re-
quire expensive low ESR capacitors greater than 1µF.
Typical ground pin current is only 850µA (at IOUT = 400mA)
and drops to 10nA when not enabled. Unlike regulators with
PNP pass devices, quiescent current remains relatively con-
stant over load variations and under dropout conditions.
The REG113 has very low output noise (typically 28µVrms
for VOUT = 3.3V with CNR = 0.01µF), making it ideal for use
in portable communications equipment. Accuracy is main-
tained over temperature, line, and load variations. Key
parameters are tested over the specified temperature range
(–40°C to +85°C).
The REG113 is well protected—internal circuitry provides a
current limit which protects the load from damage, further-
more, thermal protection circuitry keeps the chip from being
damaged by excessive temperature. The REG113 is avail-
able in SOT23-5 and MSOP-8 packages.
Enable
VIN
+
0.1µF
REG113
VOUT
+ COUT(1)
NR(2)
GND
NOTES: (1) Optional. (2) NR = Noise Reduction.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
Copyright © 2001-2003, Texas Instruments Incorporated
1 page  
TYPICAL CHARACTERISTICS (Cont.)
For all models, at TJ = +25°C and VENABLE = 1.8V, unless otherwise noted.
OUTPUT VOLTAGE ACCURACY HISTOGRAM
18
16
14
12
10
8
6
4
2
0
Error (%)
OUTPUT VOLTAGE DRIFT HISTOGRAM
30
25
20
15
10
5
0
VOUT Drift (ppm/°C)
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–50
OUTPUT VOLTAGE vs TEMPERATURE
(Referred to IOUT = 200mA at +25°C)
IOUT = 5mA
IOUT = 200mA
IOUT = 400mA
–25 0
25 50 75 100 125
Temperature (°C)
1µ
100n
GROUND PIN CURRENT, NOT ENABLED
vs TEMPERATURE
VENABLE = 0.5V
VIN = VOUT + 1V
10n
1n
100p
–50
–25
0 25 50 75
Temperature (°C)
100 125
1000
900
800
700
600
500
400
300
200
100
0
0
GROUND CURRENT vs LOAD CURRENT
VOUT = 2.5V
VOUT = 3.3V
VOUT = 5.0V
50 100 150 200 250 300 350 400
Load Current (mA)
1000
950
900
GROUND CURRENT vs TEMPERATURE
IOUT = 400mA
VOUT = 2.5V
VOUT = 3.3V
VOUT = 5.0V
850
800
750
700
–50
–25
0 25 50 75
Temperature (°C)
100 125
REG113
SBVS031C
www.ti.com
5
5 Page 
Power dissipation depends on input voltage, load condi-
tions, and duty cycle and is equal to the product of the
average output current times the voltage across the output
element (VIN to VOUT voltage drop):
PD = (VIN – VOUT ) • IOUT
(3)
Power dissipation can be minimized by using the lowest possible
input voltage necessary to assure the required output voltage.
160
150
140
130
120
110
100
90
80
70
60
0
THERMAL RESISTANCE vs PCB COPPER AREA
1234
Copper Area (inches2)
5
FIGURE 7. Thermal Resistance versus PCB Area for the MSOP-8.
REG113
SBVS031C
www.ti.com
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet REG113.PDF ] | |
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