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Número de pieza | RMPA2450 | |
Descripción | 2.4-2.5 GHz GaAs MMIC Power Amplifier | |
Fabricantes | Fairchild Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de RMPA2450 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! May 2004
RMPA2450
2.4–2.5 GHz GaAs MMIC Power Amplifier
General Description
The Fairchild RMPA2450 is a fully monolithic power
amplifier in a surface mount package for use in wireless
applications in the 2.4 to 2.5GHz ISM frequency band. The
amplifier may be biased for linear, class AB or class F for
high efficiency applications. On-chip matching components
allow operation in a 50Ω system with no external matching
components. The MMIC chip design utilizes our 0.25µm
power PHEMT process.
Features
• 35% Power Added Efficiency
• 31dBm Output Power (P1dB) at Vd = +7V
• 28dBm Output Power (P1dB) at Vd = +5V
• No external RF matching components
• Small Package Outline: 0.28" x 0.28" x 0.07"
• Thermal Resistance (Channel to Case): 33°C/W
Device
Absolute Ratings
Symbol
Vd1, Vd2
Vg1, Vg2
Vd–Vg
PIN
Ids
Ig
Tch
TCASE
TSTG
Parameter
Positive Drain DC Voltage
Negative Gate DC Voltage
Simultaneous Drain to Gate Voltage
RF Input Power (from 50Ω source)
Drain to Source Current
Gate Current
Channel Temperature
Operating Case Temperature
Storage Temperature Range
Rating
+8
-5
+10
+10
575
5
150
-40 to 100
-40 to 125
Units
V
V
V
dBm
mA
mA
°C
°C
°C
©2004 Fairchild Semiconductor Corporation
RMPA2450 Rev. C
1 page C4
C2
C6
U1
Vdd1=Vdd2
(+Vdd )
P2
RF In
J1
C2
U1
C1
P1
C4
RF Out
J2
C1
C3
C3
P2 P3
C5
Vgg1=Vgg2
(-Vgg )
P1
Ground
(GND)
P3
Figure 4. Layout and Assembly of Test Evaluation Board (RMPA2450-TB)
©2004 Fairchild Semiconductor Corporation
RMPA2450 Rev. C
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet RMPA2450.PDF ] |
Número de pieza | Descripción | Fabricantes |
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