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What is EM658160TS-5?

This electronic component, produced by the manufacturer "Etron Technology Inc.", performs the same function as "4M x 16 DDR Synchronous DRAM (SDRAM)".


EM658160TS-5 Datasheet PDF - Etron Technology Inc.

Part Number EM658160TS-5
Description 4M x 16 DDR Synchronous DRAM (SDRAM)
Manufacturers Etron Technology Inc. 
Logo Etron Technology  Inc. Logo 


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Et r onT ec h
EM658160
Etron Confidential
4M x 16 DDR Synchronous DRAM (SDRAM)
(Rev. 1.1 Jan./2002)
Features
Pin Assignment (Top View)
Fast clock rate: 300/285/250/200/166/143/125MHz
Differential Clock CK & /CK
Bi-directional DQS
DLL enable/disable by EMRS
Fully synchronous operation
Internal pipeline architecture
Four internal banks, 1M x 16-bit for each bank
Programmable Mode and Extended Mode registers
- /CAS Latency: 2, 2.5, 3
- Burst length: 2, 4, 8
- Burst Type: Sequential & Interleaved
Individual byte write mask control
DM Write Latency = 0
Auto Refresh and Self Refresh
4096 refresh cycles / 64ms
Precharge & active power down
Power supplies: VDD = 3.3V ± 0.3V
VDDQ = 2.5V ± 0.2V
Interface: SSTL_2 I/O Interface
Package: 66 Pin TSOP II, 0.65mm pin pitch
Ordering Information
Part Number
EM658160TS-3.3
EM658160TS-3.5
EM658160TS-4
EM658160TS-5
EM658160TS-6
EM658160TS-7
EM658160TS-8
Frequency
300MHz
285MHz
250MHz
200MHz
166MHz
143MHz
125MHz
Package
TSOP II
TSOP II
TSOP II
TSOP II
TSOP II
TSOP II
TSOP II
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDDQ
LDQS
NC
VDD
NC
LDM
/WE
/CAS
/RAS
/CS
NC
BS0
BS1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
66 VSS
65 DQ15
64 VSSQ
63 DQ14
62 DQ13
61 VDDQ
60 DQ12
59 DQ11
58 VSSQ
57 DQ10
56 DQ9
55 VDDQ
54 DQ8
53 NC
52 VSSQ
51 UDQS
50 NC
49 VREF
48 VSS
47 UDM
46 /CK
45 CK
44 CKE
43 NC
42 NC
41 A11
40 A9
39 A8
38 A7
37 A6
36 A5
35 A4
34 VSS
Overview
The EM658160 SDRAM is a high-speed CMOS
double data rate synchronous DRAM containing 64
Mbits. It is internally configured as a quad 1M x 16
DRAM with a synchronous interface (all signals are
registered on the positive edge of the clock signal, CK).
Data outputs occur at both rising edges of CK and /CK.
Read and write accesses to the SDRAM are burst
oriented; accesses start at a selected location and
continue for a programmed number of locations in a
programmed sequence. Accesses begin with the
registration of a BankActivate command which is then
followed by a Read or Write command. The EM658160
provides programmable Read or Write burst lengths of 2,
4, 8, full page.
An auto precharge function may be enabled to
provide a self-timed row precharge that is initiated at the
end of the burst sequence. The refresh functions, either
Auto or Self Refresh are easy to use. In addition,
EM658160 features programmable DLL option. By
having a programmable mode register and extended
mode register, the system can choose the most suitable
modes to maximize its performance. These devices are
well suited for applications requiring high memory
bandwidth, result in a device particularly well suited to
high performance main memory and graphics
applications.
Etron Technology, Inc.
No. 6, Technology Rd. V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C.
TEL: (886)-3-5782345 FAX: (886)-3-5778671
Etron Technology, Inc., reserves the right to make changes to its products and specifications without notice.

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EM658160TS-5 equivalent
Et r onT ec h
4Mx16 DDR SDRAM
EM658160
Operation Mode
Fully synchronous operations are performed to latch the commands at the positive edges of CK. Table 2
shows the truth table for the operation commands.
Table 2. Truth Table (Note (1), (2) )
Command
State CKEn-1 CKEn DM BS0,1 A10 A0-9,11 /CS /RAS /CAS /WE
BankActivate
Idle(3)
H
X X V Row address L L H H
BankPrecharge
Any H X X V L X L L H L
PrechargeAll
Any
H
X X XH
X
LL H L
Write
Write and AutoPrecharge
Active(3)
Active(3)
H
H
X X V L Column L H L L
address
X X V H (A0 ~ A7) L H L L
Read
Read and Autoprecharge
Active(3)
Active(3)
H
H
X X V L Column L H L H
address
X X V H (A0 ~ A7) L H L H
Mode Register Set
Idle H X X
OP code
LL L L
Extended MRS
Idle H X X
OP code
LL L L
No-Operation
Any H X X X X X L H H H
Burst Stop
Active(4) H X X X X X L H H L
Device Deselect
Any H X X X X X H X X X
AutoRefresh
Idle H H X X X X L L L H
SelfRefresh Entry
Idle H L X X X X L L L H
SelfRefresh Exit
Idle L H X X X X H X X X
(SelfRefresh)
LH H H
Clock Suspend Mode Entry
Active H L X X X X X X X X
Power Down Mode Entry
Any(5)
H
L X XX
X
HX X X
LH H H
Clock Suspend Mode Exit
Active L H X X X X X X X X
Power Down Mode Exit
Any L H X X X X H X X X
(PowerDown)
LH H H
Data Write/Output Enable
Active H X L X X X X X X X
Data Mask/Output Disable
Active H X H X X X X X
Note:
1. V=Valid data, X=Don't Care, L=Low level, H=High level
2. CKEn signal is input level when commands are provided.
CKEn-1 signal is input level one clock cycle before the commands are provided.
3. These are states of bank designated by BS signal.
4. Device state is 1, 2, 4, 8, and full page burst operation.
5. Power Down Mode can not enter in the burst operation.
When this command is asserted in the burst cycle, device state is clock suspend mode.
X
X
Etron Confidential
5
Rev. 1.1
Jan. 2002


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