PDF EM639165 Data sheet ( Hoja de datos )

Número de pieza	EM639165
Descripción	8Mega x 16bits SDRAM
Fabricantes	Etron Technology Inc.
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No Preview Available ! EtronTech EM639165 8M x 16 bit Synchronous DRAM (SDRAM) Advanced (Rev. 2.3, Dec. /2013) Features • Fast access time from clock: 4.5/5/5.4 ns • Fast clock rate: 200/166/143 MHz • Fully synchronous operation • Internal pipelined architecture • 2M word x 16-bit x 4-bank • Programmable Mode registers - CAS Latency: 2, or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: Sequential or Interleaved - Burst stop function • Auto Refresh and Self Refresh • 4096 refresh cycles/64ms • CKE power down mode • Single +3.3V ± 0.3V power supply • Industrial Temperature: -40~85°C • Interface: LVTTL • 54-pin 400 mil plastic TSOP II package - Pb free and Halogen free • 54-ball 8.0 x 8.0 x 1.2mm (max) FBGA package - Pb free and Halogen free Overview The EM639165 SDRAM is a high-speed CMOS synchronous DRAM containing 128 Mbits. It is internally configured as 4 Banks of 2M word x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a BankActivate command which is then followed by a Read or Write command. The EM639165 provides for programmable Read or Write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either Auto or Self Refresh are easy to use. By having a programmable mode register, the system can choose the most suitable modes to maximize its performance. These devices are well suited for applications requiring high memory bandwidth and particularly well suited to high performance PC applications. Table1. Key Specifications EM639165 tCK3 Clock Cycle time(min.) tAC3 Access time from CLK(max.) tRAS Row Active time(min.) tRC Row Cycle time(min.) -5I/6I/7I 5/6/7 4.5/5/5.4 40/42/42 55/60/63 ns ns ns ns Table 2. Ordering Information Part Number EM639165TS -5IG Frequency 200MHz Package TSOPII EM639165TS -6IG 166MHz TSOPII EM639165TS -7IG EM639165BM -5IH 143MHz 200MHz TSOPII FBGA EM639165BM -6IH 166MHz FBGA EM639165BM -7IH 143MHz FBGA TS: indicates TSOPII Package BM: indicates 8.0 x 8.0 x 1.2mm FBGA Package I: indicates Industrial Grade G: indicates Pb and Halogen Free for TSOPII Package H: indicates Pb free and Halogen Free for FBGA Package Etron Technology, Inc. No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C. TEL: (886)-3-5782345 FAX: (886)-3-5778671 Etron Technology, Inc. reserves the right to change products or specification without notice. 1 page EtronTech EM639165 LDQM, UDQM DQ0-DQ15 NC/RFU VDDQ VSSQ VDD VSS Input Input / Output - Supply Supply Supply Supply Data Input/Output Mask: Controls output buffers in read mode and masks Input data in write mode. Data I/O: The DQ0-15 input and output data are synchronized with the positive edges of CLK. The I/Os are maskable during Reads and Writes. No Connect: These pins should be left unconnected. DQ Power: Provide isolated power to DQs for improved noise immunity. ( 3.3V± 0.3V ) DQ Ground: Provide isolated ground to DQs for improved noise immunity. (0V) Power Supply: +3.3V ± 0.3V Ground Rev. 2.3 5 Dec. /2013 5 Page EtronTech EM639165 CLK COMMAND T0 T1 T2 T3 T4 T5 T6 T7 T8 NOP WRITE A READ B NOP NOP NOP NOP NOP NOP CAS# Latency=2 tCK2, DQ DIN A0 don’t care DOUT B0 DOUT B1 DOUT B2 DOUT B3 CAS# Latency=3 tCK3, DQ DIN A0 don’t care don’t care DOUT B0 DOUT B1 DOUT B2 DOUT B3 Input data must be removed from the DQ at least one clock cycle before the Read data appears on the outputs to avoid data contention Figure 13. Write Interrupted by a Read (Burst Length = 4, CAS# Latency = 2, 3) The BankPrecharge/PrechargeAll command that interrupts a write burst without the auto precharge function should be issued m cycles after the clock edge in which the last data-in element is registered, where m equals tWR/tCK rounded up to the next whole number. In addition, the DQM signals must be used to mask input data, starting with the clock edge following the last data-in element and ending with the clock edge on which the BankPrecharge/PrechargeAll command is entered (refer to the following figure). T0 T1 T2 T3 T4 T5 T6 T7 CLK DQM COMMAND WRITE NOP NOP Precharge tRP NOP NOP Activate NOP ADDRESS DQ Bank Col n DIN n tWR DIN N+1 Bank (s) ROW Don’t Care Note: The DQMs can remain low in this example if the length of the write burst is 1 or 2. Figure 14. Write to Precharge 7 Write and AutoPrecharge command (RAS# = "H", CAS# = "L", WE# = "L", BAs = Bank, A10 = "H", A0-A8 = Column Address) The Write and AutoPrecharge command performs the precharge operation automatically after the write operation. Once this command is given, any subsequent command can not occur within a time delay of {(burst length -1) + tWR + tRP (min.)}. At full-page burst, only the write operation is performed in this command and the auto precharge function is ignored. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 CLK COMMAND Bank A Activate NOP NOP WRITE A Auto Precharge NOP NOP tDAL NOP NOP NOP DQ DIN A0 DIN A1 tDAL=tWR+tRP Begin AutoPrecharge Bank can be reactivated at completion of tDAL Figure 15. Burst Write with Auto-Precharge (Burst Length = 2) Bank A Activate Rev. 2.3 11 Dec. /2013 11 Page

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