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PDF ECG014B-PCB900 Data sheet ( Hoja de datos )
| Número de pieza | ECG014B-PCB900 | |
| Descripción | 0.2 Watt/ High Linearity InGaP HBT Amplifier | |
| Fabricantes | ETC | |
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ECG014
0.2 Watt, High Linearity InGaP HBT Amplifier
The Communications Edge TM
Product Information
Product Features
• 50 – 2000 MHz
• +23 dBm P1dB
• +39 dBm Output IP3
• 20.5 dB Gain @ 900 MHz
• 17.6 dB Gain @ 1900 MHz
• Single Positive Supply (+8V)
• SOT-89 SMT Package
Applications
• Mobile Infrastructure
• Defense/Homeland Security
Product Description
The ECG014 is a high dynamic range driver amplifier in a
low-cost surface mount package. The InGaP/GaAs HBT is
able to achieve performance over a broad range with +39
dBm OIP3 and +23 dBm of compressed 1-dB power and is
housed in an industry standard SOT-89 SMT package. All
devices are 100% RF and DC tested.
The product is targeted for use as a gain block/driver
amplifier for various current and next generation wireless
technologies such as GPRS, GSM and CDMA, where high
linearity and medium power is required. In addition, the
ECG014 will work for numerous other applications within
the 50 to 2000 MHz frequency range.
Functional Diagram
GND
4
123
RF IN GND RF OUT
ECG014B
Specifications (1)
Typical Performance (5)
Parameters
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output OIP3 (2)
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
IS-95A Channel Power
@ -45 dBc ACPR, 1900 MHz
Noise Figure
Operating Current Range (3)
Device Voltage (4)
Units
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dBm
dBm
dBm
dB
mA
V
Min
50
18.5
+22
+38
17
+36.5
85
Typ
900
20.5
+23
+39
1900
17.6
17
7.4
+23
+38
+16
5.2
100
5
Max
2000
135
1. Test conditions unless otherwise noted: 25 °C, Vsupply = +8V, in tuned application circuit with
Rbias = 30 Ω.
2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. The tuned
application circuit is tuned for optimum ACPR performance. An improvement in OIP3 of 2 to 3
dB can be achieved for tuning for optimum OIP3 (with slightly degraded ACPR performance).
3. This corresponds to the quiescent current or operating current under small-signal conditions.
4. This device requires a minimum 7 V power supply through a dropping resistor. 8 V and 30 ohms
are recommended for proper operation. Operation of the device directly to a 5 V supply could lead
to thermal damage to the device.
Parameters
Frequency
S21 – Gain
S11 – Input R.L.
S22 – Output R.L.
Output P1dB
Output IP3 (2)
IS-95A Channel Power
@ -45 dBc ACPR, 1900 MHz
Noise Figure
Supply Bias
Units
MHz
dB
dB
dB
dBm
dBm
dBm
dB
Typical
900 1900
20.5 17.6
-20 -17
-9.5 -7.4
+22.8
+23
+39 +38
+17 +16
5 5.2
+8 V @ 100 mA
5. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc =
100 mA, +25° C, Rbias = 30 Ω.
Absolute Maximum Rating
Ordering Information
Parameters
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Voltage
Device Current
Device Power
Junction Temperature
Rating
-40 to +85 °C
-65 to +150 °C
+12 dBm
+6 V
150 mA
1.5 W
+250 °C
Part No.
ECG014B
ECG014B-PCB900
ECG014B-PCB1900
Description
0.2 Watt, High Linearity InGaP HBT Amplifier
900 MHz Evaluation Board
1900 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
1 page  
ECG014
0.2 Watt, High Linearity InGaP HBT Amplifier
Outline Drawing
The Communications Edge TM
Product Information
Product Marking
The component will be marked with an “E014”
designator with an alphanumeric lot code on the
top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application Notes”
section.
ESD / MSL Information
Land Pattern
ESD Rating: Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235° C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use
a .35mm (#80 / .0135”) diameter drill and have a
final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and
outer layers near the part to ensure optimal
thermal performance.
3. Mounting screws can be added near the part to
fasten the board to a heatsink. Ensure that the
ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the
PC board in the region where the board contacts
the heatsink.
5. RF trace width depends upon the PC board
material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Angles are in degrees.
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85° C
Thermal Resistance, Rth (1)
128° C / W
Junction Temperature, Tjc (2)
149° C
Notes:
1. The thermal resistance is referenced from the
junction-to-case at a case temperature of 85° C.
2. This corresponds to the typical biasing condition of
+5V, 100 mA at an 85° C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247° C.
MTTF vs. GND Tab Temperature
100000
10000
1000
100
60
70 80 90 100 110 120
Tab Temperature (°C)
.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
August 2004
5 Page | ||
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