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Número de pieza | EBS21RC2ACNA-75 | |
Descripción | 2GB Registered SDRAM DIMM | |
Fabricantes | Elpida Memory | |
Logotipo | ||
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2GB Registered SDRAM DIMM
EBS21RC2ACNA (256M words × 72 bits, 2 banks)
Description
Features
The EBS21RC2ACNA is 256M words × 72 bits, 2
banks Synchronous Dynamic RAM Registered Module,
mounted 72 pieces of 256M bits SDRAM sealed in
TCP package. This module provides high density and
large quantities of memory in a small space without
utilizing the surface mounting technology. Decoupling
capacitors are mounted on power supply line for noise
reduction.
Note: Do not push the cover or drop the modules in
order to protect from mechanical defects, which
would be electrical defects.
• Fully compatible with 8 bytes DIMM: JEDEC
standard outline
• 168-pin socket type dual in line memory module
(DIMM)
PCB height: 41.91mm (1.65inch )
Lead pitch: 1.27mm
• 3.3V power supply
• Clock frequency: 133MHz (max.)
• LVTTL interface
• Data bus width: × 72 ECC
• Single pulsed /RAS
• 4 Banks can operates simultaneously and
independently
• Burst read/write operation and burst read/single write
operation capability
• Programmable burst length (BL): 1, 2, 4, 8
• 2 variations of burst sequence
Sequential
Interleave
• Programmable /CAS latency (CL): 2, 3
• Registered inputs with one clock delay
• Byte control by DQMB
• Refresh cycles: 8192 refresh cycles/64ms
• 2 variations of refresh
Auto refresh
Self refresh
• 1 piece of PLL clock driver, 3 pieces of register driver
and 1 piece of serial EEPROM (2k bits) for Presence
Detect (SPD) on PCB.
Document No. E0105E50 (Ver. 5.0)
Date Published June 2002 (K) Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2001-2002
1 page EBS21RC2ACNA
Byte No. Function described
27
Minimum row precharge time
(-7A)
(-75)
28 Row active to row active min
29
/RAS to /CAS delay min
(-7A)
(-75)
30 Minimum /RAS pulse width
31 Density of each bank on module
32
33
34
35
36 to 40
41
42 to 61
62
63
64 to 65
66
67 to 71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
Address and command signal input
setup time
Address and command signal input
hold time
Data signal input setup time
Data signal input hold time
Superset information
Minimum bank Cycle
(-7A)
(-75)
Superset information
SPD data revision code
Checksum for bytes 0–62
(-7A)
(-75)
Manufacturer’s JEDEC ID code
Manufacturer’s JEDEC ID code
Manufacturer’s JEDEC ID code
Manufacturing location
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
Manufacturer’s part number
(-7A)
(-75)
Manufacturer’s part number
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value
0 0 0 0 1 1 1 1 0FH
0 0 0 1 0 1 0 0 14H
0 0 0 0 1 1 1 1 0FH
0 0 0 0 1 1 1 1 0FH
0 0 0 1 0 1 0 0 14H
0 0 1 0 1 1 0 1 2DH
0 0 0 0 0 0 0 1 01H
0 0 0 1 0 1 0 1 15H
0 0 0 0 1 0 0 0 08H
0 0 0 1 0 1 0 1 15H
0 0 0 0 1 0 0 0 08H
0 0 0 0 0 0 0 0 00H
0 0 1 1 1 1 0 0 3CH
0 1 0 0 0 0 1 1 43H
0 0 0 0 0 0 0 0 00H
0 0 0 1 0 0 1 0 12H
0 0 1 1 0 1 1 0 36H
0 1 1 1 1 1 1 0 7EH
0 1 1 1 1 1 1 1 7FH
1 1 1 1 1 1 1 0 FEH
0 0 0 0 0 0 0 0 00H
× × × × × × × × ××
0 1 0 0 0 1 0 1 45H
0 1 0 0 0 0 1 0 42H
0 1 0 1 0 0 1 1 53H
0 0 1 1 0 0 1 0 32H
0 0 1 1 0 0 0 1 31H
0 1 0 1 0 0 1 0 52H
0 1 0 0 0 0 1 1 43H
0 0 1 1 0 0 1 0 32H
0 1 0 0 0 0 0 1 41H
0 1 0 0 0 0 1 1 43H
0 1 0 0 1 1 1 0 4EH
0 1 0 0 0 0 0 1 41H
0 0 1 0 1 1 0 1 2DH
0 0 1 1 0 1 1 1 37H
0 1 0 0 0 0 0 1 41H
0 0 1 1 0 1 0 1 35H
0 0 1 0 0 0 0 0 20H
Comments
15ns
20ns
15ns
15ns
20ns
45ns
2 bank
1G byte
1.5ns*5
0.8ns*5
1.5ns*5
0.8ns*5
Future use
60ns
67.5ns
Future use
Rev. 1.2
54
126
Continuation code
Elpida Memory
*2 (ASCII-8bit code)
E
B
S
2
1
R
C
2
A
C
N
A
—
7
A
5
(Space)
Data Sheet E0105E50 (Ver. 5.0)
5
5 Page EBS21RC2ACNA
Relationship Between Frequency and Minimum Latency (SDRAM device specification)
Parameter
-7A -75
Frequency (MHz)
133 133 133 100
tCK (ns)
7.5 7.5 7.5 10
/CAS latency
Active command to column command
(same bank)
Active command to active command
(same bank)
Active command to precharge command
(same bank)
Precharge command to active command
(same bank)
Write recovery or data-in to precharge
command (same bank)
Active command to active command
(different bank)
Self refresh exit time
Last data in to active command
(Auto precharge, same bank)
Symbol
lRCD
lRC
lRAS
lRP
lDPL
lRRD
lSREX
lDAL
CL = 3
2
8
6
2
2
2
1
4
CL = 2
2
8
6
2
2
2
1
4
CL = 3
3
9
6
3
2
2
1
5
CL = 2
2
7
5
2
2
2
1
4
Self refresh exit to command input
lSEC
8
8
9
7
Precharge command to high impedance lHZP
3
2
Last data out to active command
(auto precharge) (same bank)
Last data out to precharge (early
precharge)
Column command to column command
lAPR
lEP
lCCD
1
–2
1
1
–1
1
Write command to data in latency
lWCD
0
0
DQM to data in
lDID 0
0
DQM to data out
lDOD
2
2
CKE to CLK disable
lCLE
1
1
Register set to active command
lMRD
1
1
/CS to command disable
lCDD
0
0
Power down exit to command input
lPEC
1
1
Notes: 1. IRCD to IRRD are recommended value.
2. Be valid [DESL] or [NOP] at next command of self refresh exit.
3. Except [DESL] and [NOP]
3
1
–2
1
0
0
2
1
1
0
1
2
1
–1
1
0
0
2
1
1
0
1
Notes
1
1
1
1
1
1
2
= [lDPL + lRP]
= [lRC]
3
Data Sheet E0105E50 (Ver. 5.0)
11
11 Page |
Páginas | Total 15 Páginas | |
PDF Descargar | [ Datasheet EBS21RC2ACNA-75.PDF ] |
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