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DF17C-80DP-0.5V Schematic ( PDF Datasheet ) - Hirose Electric

Teilenummer DF17C-80DP-0.5V
Beschreibung 0.5mm Pitch Board to Board Connector
Hersteller Hirose Electric
Logo Hirose Electric Logo 




Gesamt 12 Seiten
DF17C-80DP-0.5V Datasheet, Funktion
0.5mm Pitch Board to Board Connector
DF17 Series
sFeatures
1. DF17 series are the connector which has
been developed mainly for the mobile
phone.
Connector Problems Involving in Mobile phone
Example:
The following problems can be solved;
"Connector Damage Caused when Mobile
phone is Dropped"
"Electrical Discontinuity in Printed Circuit
Board is Fixed (Fastened by screws)"
Especially, in regard to the resistance to the
drop shock, Hirose has developed a new
connector structure utilizing its unique
technology, and greatly enhanced the
resistance to the drop shock.
In broad variation development, the connector
can be utilized in wide fields of LCD equipment,
miniature information terminal equipment and
so on, in addition to mobile phones.
Solution of Connector Damage
Caused when Mobile
Phone is Dropped
A319






DF17C-80DP-0.5V Datasheet, Funktion
s Header With metal fitting
P = 0.5
A
B
C
D
0.2
Ø 0.5
E
q Stacking Height: 4mm
F
Part Number
DF17(1.0H)-26DP-0.5V(51)
DF17(1.0H)-30DP-0.5V(51)
DF17(1.0H)-60DP-0.5V(51)
CL No.
683-0257-3-51
683-0272-7-51
683-0365-6-51
Number of Contacts
26
30
60
A
11.5
12.5
20.0
B
08.2
09.2
16.7
C
07.1
08.1
15.6
D
06.0
07.0
14.5
E
08.5
09.5
17.0
F
11.3
12.3
19.8
G
3.3
q Stacking Height: 5mm, 6mm
Part Number
DF17(2.0)-20DP-0.5V(51)
DF17(2.0)-30DP-0.5V(51)
DF17(2.0)-40DP-0.5V(51)
DF17(2.0)-50DP-0.5V(51)
DF17(2.0)-60DP-0.5V(51)
DF17(2.0)-70DP-0.5V(51)
DF17(2.0)-80DP-0.5V(51)
CL No.
683-0082-1-51
683-0083-4-51
683-0084-7-51
683-0085-0-51
683-0086-2-51
683-0087-5-51
683-0088-8-51
Number of Contacts
20
30
40
50
60
70
80
A
10.0
12.5
15.0
17.5
20.0
22.5
25.0
B
06.7
09.2
11.7
14.2
16.7
19.2
21.7
C
05.6
08.1
10.6
13.1
15.6
18.1
20.6
D
04.5
07.0
09.5
12.0
14.5
17.0
19.5
E
07.0
09.5
12.0
14.5
17.0
19.5
22.0
F
09.8
12.3
14.8
17.3
19.8
22.3
24.8
G
4.3
q Stacking Height: 7mm, 8mm
Part Number
DF17(4.0)-20DP-0.5V(51)
DF17(4.0)-30DP-0.5V(51)
DF17(4.0)-40DP-0.5V(51)
DF17(4.0)-50DP-0.5V(51)
DF17(4.0)-60DP-0.5V(51)
DF17(4.0)-70DP-0.5V(51)
DF17(4.0)-80DP-0.5V(51)
CL No.
683-0122-4-51
683-0123-7-51
683-0124-0-51
683-0125-2-51
683-0126-5-51
683-0127-8-51
683-0128-0-51
Number of Contacts
20
30
40
50
60
70
80
A
10.0
12.5
15.0
17.5
20.0
22.5
25.0
B
06.7
09.2
11.7
14.2
16.7
19.2
21.7
C
05.6
08.1
10.6
13.1
15.6
18.1
20.6
D
04.5
07.0
09.5
12.0
14.5
17.0
19.5
E
07.0
09.5
12.0
14.5
17.0
19.5
22.0
F
09.8
12.3
14.8
17.3
19.8
22.3
24.8
Note 1. In regard to this product, the embossed tape packaging is the standard packaging. (1000 pcs./reel.)
If the (50) tube packaging is required, please contact HRS company.
Note 2. If the without boss specification is required, please contact HRS sales department.
G
6.3
H
1.0
H
2.0
H
4.0
A324

6 Page









DF17C-80DP-0.5V pdf, datenblatt
s Precautions
1. Recommended
Temperature Profile
(SMT)
Temperature
250ç
200ç
IR reflow condition
Preheating area 150ç for 100 to 120 seconds
Soldering area 235ç5ç for 10 seconds max.
220ç min for 10 to 30 seconds
150ç
100ç
50ç
Preheating area
240ç max.
220ç
Soldering area
0ç
0SSEC
50SSEC
100SSEC
150SSEC
200SSEC Time
Note 1. Maximum twice action is allowed under the same condition. However, the interval between
the first and second actions must be maintained at the room temperature.
Note 2.The temperature indicates the board surface temperature of the connector lead area.
2. Recommended Manual
Soldering Condition
(SMT)
Soldering iron temperature: 290±10çoldering time: Within 2 seconds
3. Recommended
Screen Thickness
(SMT)
0.15mm
4. Board Warp(SMT)
Max 0.2mm in the connector center area, based on the both connector edges
5. Cleaning Condition
Refer to the "Nylon Connector Use Hand book".
6. Cautions
s The header is designed in a structure where contacts are exposed. Touching it with bare
hands would cause contact failure or electrostatic element damage.
s Where no board is mounted, the insertion or extraction will cause damage or contact deformation.
s Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
s Excessive scoop insertion or extraction may result in damage.
s In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.
s The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
A330

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