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ACS86DMSR Schematic ( PDF Datasheet ) - Intersil Corporation

Teilenummer ACS86DMSR
Beschreibung Radiation Hardened Quad 2-Input Exclusive OR Gate
Hersteller Intersil Corporation
Logo Intersil Corporation Logo 




Gesamt 6 Seiten
ACS86DMSR Datasheet, Funktion
ACS86MS
April 1995
Radiation Hardened
Quad 2-Input Exclusive OR Gate
Features
• 1.25 Micron Radiation Hardened SOS CMOS
• Total Dose 300K RAD (Si)
• Single Event Upset (SEU) Immunity
<1 x 10-10 Errors/Bit-Day (Typ)
• SEU LET Threshold >80 MEV-cm2/mg
• Dose Rate Upset >1011 RAD (Si)/s, 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55oC to +125oC
• Significant Power Reduction Compared to ALSTTL
Logic
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
• Input Current 1µA at VOL, VOH
Description
The Intersil ACS86MS is a radiation hardened quad 2-input
exclusive OR gate. A high logic level on both inputs forces
the output to a logic low state.
The ACS86MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of the
radiation hardened, high-speed, CMOS/SOS Logic Family.
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C
TOP VIEW
A1 1
B1 2
Y1 3
A2 4
B2 5
Y2 6
GND 7
14 VCC
13 B4
12 A4
11 Y4
10 B3
9 A3
8 Y3
14 LEAD CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C
TOP VIEW
A1
B1
Y1
A2
B2
Y2
GND
1 14
2 13
3 12
4 11
5 10
69
78
VCC
B4
A4
Y4
B3
A3
Y3
Ordering Information
PART NUMBER
ACS86DMSR
ACS86KMSR
ACS86D/Sample
ACS86K/Sample
ACS86HMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
+25oC
+25oC
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
14 Lead SBDIP
14 Lead Ceramic Flatpack
14 Lead SBDIP
14 Lead Ceramic Flatpack
Die
Truth Table
INPUTS
OUTPUT
An Bn Yn
LLL
L HH
HLH
HH L
NOTE: L = Logic Level Low, H = Logic Level High
Functional Diagram
(1, 4, 9, 12)
An
Bn
(2, 5, 10, 13)
(3, 6, 8, 11)
Yn
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
Spec Number 518849
File Number 3995






ACS86DMSR Datasheet, Funktion
Die Characteristics
DIE DIMENSIONS:
88 mils x 88 mils
2.24mm x 2.24mm
METALLIZATION:
Type: AlSiCu
Metal 1 Thickness: 6.75kÅ (Min), 8.25kÅ (Max)
Metal 2 Thickness: 9kÅ (Min), 11kÅ (Max)
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
ACS86MS
DIE ATTACH:
Material: Silver Glass or JM7000 Polymer after 7/1/95
WORST CASE CURRENT DENSITY:
< 2.0 x 105 A/cm2
BOND PAD SIZE:
> 4.3 mils x 4.3 mils
> 110µm x 110µm
Metallization Mask Layout
ACS86MS
B1 A1 VCC B4
(2) (1) (14) (13)
Y1 (3)
A2 (4)
NC
B2 (5)
(12) A4
(11) Y4
NC
(10) B3
(6) (7) (8)
Y2 GND Y3
(9)
A3
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518849
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