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Teilenummer | W83312SN |
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Beschreibung | Bus Termination Regulator | |
Hersteller | nuvoton | |
Logo | ||
Gesamt 28 Seiten Nuvoton
Bus Termination Regulator
W83312SN
W83312SN
3. BLOCK DIAGRAM
VREF
Current Limit
Protection
Thermal
Shutdown
VCNTL
Control
Logic
VIN
VOUT
GND
4. PIN CONFIGURATION AND TYPICAL APPLICATION CIRCUIT
VIN 1
GND 2
VREF 3
VOUT 4
8 NC
7 NC
6 VCNTL
5 NC
W83312SN
(Top View)
Publication Date: Mar., 2010
-2- Revision A5
6 Page W83312SN
Operating Temperature Range
Junction Temperature Range (Note3)
-40 85
-40 125
°C
°C
7.4 Electrical Characteristics
Typicals and limits appearing in normal type apply for Tj = 25°C. Limits appearing in Boldface type apply
over the entire junction temperature range for operation, -40 ° C to 85 ° C (Note4). VCNTL= 3.3V/5V,
VIN=2.5V/1.8V/1.5V, VREF=1.25V/0.9V/0.75V, COUT=100uF, all voltage outputs unloaded (unless
otherwise noted).
Input
PARAMETER
VCNTL Operating Current
VIN Operating Current
VCNTL Quiescent Current in
Shutdown Mode
VIN Quiescent Current in
Shutdown Mode
VREF Leakage Current
Output (DDR1 / DDR2 / DDR3)
Output Offset Voltage (VREF-
VOUT)
Load Regulation (VREF-VOUT)
Protection
Current Limit
Thermal Shutdown Temperature
SYMBOL
TEST CONDITION
MIN TYP MAX UNITS
I CNTL
I VIN
I SD_CNTL
IOUT=0A, VCNTL=3.3V
IOUT=0A, VCNTL=5V
IOUT=0A, VCNTL=3.3V
IOUT=0A, VCNTL=5V
VREF < 0.2V, VCNTL=3.3V
VREF < 0.2V, VCNTL=5V
0.5 0.7
0.7 1
0.3 0.5
0.3 0.5
60 90
60 90
I SD_VIN
I IH
I IL
VREF < 0.2V
VREF=3.3V
VREF=0V
-1 0 1
-1 0 1
-1 0 1
mA
mA
uA
uA
uA
V OS
∆V L
I OUT =0A
IOUT=0 → +2.5A (Note5)
IOUT=0 → -2.5A (Note5)
ILIM In any VIN
TSD 3.3V < VCNTL < 5V (Note6)
-5 5 mV
-20 20
mV
-20 20
±3 ±3.5 ±4.5
150 165 175
A
°C
Thermal Shutdown Hysteresis
∆TSD 3.3V < VCNTL < 5V
30 °C
VREF Shutdown Mode
Shutdown Threshold
VIH Enable
VIL Disable
0.6
V
0.2
Note1. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the
device. These are stress ratings only and functional operation of the device at these or any other
conditions beyond those indicated under recommended operating conditions is not implied. Exposure to
absolute maximum rated conditions for extended periods may affect device reliability.
Note2. Devices are ESD sensitive. Handling precaution recommended.
Note3. At elevated temperatures, devices must be de-rated based on thermal resistance. The device in the
ESOP-8 package must be de-rated at θJA=75˚C/W junction to ambient with minimum PCB footprint.
Publication Date: Mar., 2010
-8- Revision A5
12 Page | ||
Seiten | Gesamt 28 Seiten | |
PDF Download | [ W83312SN Schematic.PDF ] |
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