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R5F2L358CNFP Schematic ( PDF Datasheet ) - Renesas

Teilenummer R5F2L358CNFP
Beschreibung MCU
Hersteller Renesas
Logo Renesas Logo 




Gesamt 30 Seiten
R5F2L358CNFP Datasheet, Funktion
Datasheet
R8C/L35C Group, R8C/L36C Group, R8C/L38C Group, R8C/L3AC Group
R01DS0095EJ0101
RENESAS MCU
Rev.1.01
Apr 15, 2011
1. Overview
1.1 Features
The R8C/L35C Group, R8C/L36C Group, R8C/L38C Group, and R8C/L3AC Group of single-chip MCUs
incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and
supports a 1 Mbyte address space, allowing execution of instructions at high speed. In addition, the CPU core
integrates a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the
number of system components.
These groups have data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1 Applications
Household appliances, office equipment, audio equipment, consumer products, etc.
R01DS0095EJ0101 Rev.1.01
Apr 15, 2011
Page 1 of 72






R5F2L358CNFP Datasheet, Funktion
R8C/L35C Group, R8C/L36C Group, R8C/L38C Group, R8C/L3AC Group
1. Overview
Table 1.6 Specifications (3)
Item
Flash Memory
Operating Frequency/
Supply Voltage
Current Consumption
Operating Ambient Temperature
Specification
• Programming and erasure voltage: VCC = 2.7 to 5.5 V
• Programming and erasure endurance: 10,000 times (data flash)
1,000 times (program ROM)
• Program security: ROM code protect, ID code check
• On-chip debug function
• On-board flash rewrite function
• Background operation (BGO) function
f(XIN) = 20 MHz (VCC = 2.7 to 5.5 V)
f(XIN) = 5 MHz (VCC = 1.8 to 5.5 V)
Typ. 7 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 3.6 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 3.5 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz))
Typ. 2 µA (VCC = 3.0 V, stop mode)
Typ. 0.02 µA (VCC = 3.0 V, power-off mode)
-20 to 85°C (N version)
-40 to 85°C (D version) (1)
Note:
1. Specify the D version if D version functions are to be used.
R01DS0095EJ0101 Rev.1.01
Apr 15, 2011
Page 6 of 72

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R5F2L358CNFP pdf, datenblatt
R8C/L35C Group, R8C/L36C Group, R8C/L38C Group, R8C/L3AC Group
1. Overview
8
I/O ports
Port P0
Peripheral functions
Timers
Timer RA (8 bits × 1)
Timer RB (8 bits × 1)
Timer RC (16 bits × 1)
Timer RD (16 bits × 2)
Timer RE (8 bits × 1)
Timer RG (16 bits × 1)
Watchdog timer
(14 bits)
A/D converter
(10 bits × 10 channels)
D/A converter
(8 bits × 2 channels)
Voltage detection circuit
48
8
Port P2
Port P3
Port P4
UART or
clock synchronous serial I/O
(8 bits × 3)
I2C bus or SSU
(8 bits × 1)
LIN module
Comparator B
System clock generation
circuit
XIN-XOUT
High-speed on-chip oscillator
Low-speed on-chip oscillator
XCIN-XCOUT
DTC
Low-speed on-chip oscillator
for watchdog timer
LCD drive control circuit
Common output: Max. 8 pins
Segment output: Max. 32 pins
R8C CPU core
R0H
R1H
R2
R3
A0
A1
FB
R0L
R1L
SB
USP
ISP
INTB
PC
FLG
Memory
ROM (1)
RAM (2)
Multiplier
8
8
4
4
Figure 1.6 Block Diagram of R8C/L36C Group
Notes:
1. ROM capacity varies with MCU type.
2. RAM capacity varies with MCU type.
R01DS0095EJ0101 Rev.1.01
Apr 15, 2011
Page 12 of 72

12 Page





SeitenGesamt 30 Seiten
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