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Teilenummer | ACPM-7881 |
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Beschreibung | W-CDMA Power Amplifer | |
Hersteller | AVAGO | |
Logo | ||
Gesamt 12 Seiten ACPM - 7881
W-CDMA Power Amplifer
Data Sheet
Description
The ACPM-7881 is a high performance W-CDMA power
amplifier module offered in a 4x4x1.1mm package. De-
signed around Avago Technologies’ GaAs Enhancement
Mode pHEMT process, the ACPM-7881 offers premium
power added efficiency and linearity in a very small form
factor. The PA is fully matched to 50 Ohms on the input
and output.
The amplifier has excellent ACLR and efficiency perfor-
mance at max Pout, 28.5dBm, and low quiescent current
(50mA) with a single bias control voltage, Vctrl = 2.0V. No
regulated voltages are required to set the bias, Vdd2 can
be connected directly to the battery.
Designed in a surface mount RF package, the ACPM-7881
is very cost and size competitive.
Functional Block Diagram
Vdd1 Vdd
(1) (10)
Features
• Operating frequency: 1920 - 1980 MHz
• 28.5 dBm Linear Output Power @ 3.5V
• High Efficiency 46% PAE
• Single bias, low quiescent current (50mA)
• Internal 50 ohm matching networks for both RF input
& output
• No regulated voltages required
• 3.2 - 4.5 V linear operation
• 4.0 x 4.0mm SMT Package
• Low package profile, 1.1mm
Applications
• W-CDMA Handsets
• Data Cards
• PDAs
RF in
()
Bias Control
MMIC
Output
Match
Module
Vctrl Vdd Gnd
() () (,,,)
RF out
()
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 9. ACLR2 vs Pout
30
29
28
27
26
25
24
23
22
21
20
-25 -20 -15 -10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 10. Gain vs Pout
Data measured at 1980MHz
60
50
40
30
20
10
0
-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 11. PAE vs Pout
-20
-25
-30
-35
-40
-45
-50
-55
-60
-65
-70
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 14. ACLR2 vs Pout
600
500
400
300
200
100
0
-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 12. Total Idd vs Pout
30
29
28
27
26
25
24
23
22
21
20
-25 -20 -15 -10 -5 0 5 10 15 20 25 30
Pout (dBm)
Figure 15. Gain vs Pout
-20
-25
-30
-35
-40
-45
-50
-55
-60-10 -5 0
5 10 15 20 25 30
Pout (dBm)
Figure 13. ACLR1 vs Pout
6 Page Solder Paste Recommendation
The ACPM-7881 package is a lead free package that was
proven to pass MSL3 when reflowed under lead free solder
reflow profile. The recommended lead free solder for SMT
reflow is Sn-Ag-Cu (95.5%Tin, 3.8% Silver, 0.7% Copper) or
other similar Sn-Ag-Cu solders. This lead free solder paste
has a melting point of 218°C (423°F), the ternary eutectic
of Sn-Ag-Cu system, giving it the advantage of being the
lowest melting lead free alternative. This temperature is still
low enough to protect from damaging the internal circuitry
during solder reflow operations provided the exposure time
at peak reflow temperatures is not too excessive.
In certain situations, the designer may use leaded solder
paste for reflow. The recommended solder for mounting
ACPM-7881 package is Sn63 (63% Sn, 37% Pb). It is a eutectic
compound with a typical melting point of 183°C.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-1894EN - April 6, 2006
12 Page | ||
Seiten | Gesamt 12 Seiten | |
PDF Download | [ ACPM-7881 Schematic.PDF ] |
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