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ACPM-5201 Schematic ( PDF Datasheet ) - AVAGO

Teilenummer ACPM-5201
Beschreibung Power Amplifier Module
Hersteller AVAGO
Logo AVAGO Logo 




Gesamt 13 Seiten
ACPM-5201 Datasheet, Funktion
ACPM-5201
UMTS Band1 (1920-1980MHz) 3x3mm Power Amplifier Module
Data Sheet
Description
The ACPM-5201 is a fully matched 10-pin surface mount
module developed for UMTS Band1. This power amplifier
module operates in the 1920-1980MHz bandwidth. The
ACPM-5201 meets stringent UMTS linearity requirements
up to 27.5dBm output power. The 3mmx3mm form factor
package is self contained, incorporating 50ohm input and
output matching networks. The PA also contains internal
DC blocking capacitors for RF input and output ports.
The ACPM-5201 features 5th generation of CoolPAM
(CoolPAM5) circuit technology which supports 3 power
modes – active bypass, mid power and high power modes.
The CoolPAM is stage bypass technology enhancing PAE
(power added efficiency) at low and medium power
range. The active bypass feature is added to CoolPAM5 to
enhance the PAE further at low output range and it enables
the PA to have exceptionally low quiescent current. It
dramatically saves the average power consumption and
accordingly extends the talk time of mobiles and prolongs
a battery life.
A directional coupler is integrated into the module and
both coupling and isolation ports are available exter-
nally, supporting daisy chain. The integrated coupler has
excellent coupler directivity, which minimizes the coupled
output power variation or delivered power variation
caused by the load mismatch from the antenna. The
coupler directivity, or the output power variation into
the mismatched load, is critical to the TRP and SAR per-
formance of the mobile phones in real field operations as
well as compliance tests for the system specifications.
The ACPM-5201 has integrated on-chip Vref and on-module
bias switch as the one of the key features of the CoolPAM-
5, so an external constant voltage source is not required,
eliminating the external LDO regulators and switches
from circuit boards of mobile devices. It also makes the PA
fully digital-controllable by the Ven pin that simply turns
the PA on and off from the digital control logic input from
baseband chipsets. All of the digital control input pins
such as the Ven, Vmode and Vbp are fully CMOS compat-
ible and can operate down to the 1.35V logic. The current
consumption by digital control pins is negligible.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology
offering state-of-the-art reliability, temperature stability
and ruggedness.
Features
Thin Package (1.0mm typ)
Excellent Linearity
3-mode power control with Vbp and Vmode
– Bypass / Mid Power Mode / High Power Mode
High Efficiency at max output power
10-pin surface mounting package
Internal 50ohm matching networks for both RF input
and output
Integrated coupler
– Coupler and Isolation ports for daisy chain
Green (Lead-free and RoHS compliant)
Applications
UMTS Band1
Ordering Information
Part Number
ACPM-5201-TR1
ACPM-5201-BLK
Number of Devices
1000
100
Container
178mm (7”)
Tape/Reel
Bulk






ACPM-5201 Datasheet, Funktion
Metallization
0.25
0.60
on 0.5mm pitch
Ø 0.3mm
0.45
0.35 0.475
0.55
Note: Please put isolation and RF out lines in different layers for better
isolation
Solder Mask Opening
0.65
0.50
PCB Design Guidelines
The recommended PCB land pattern is shown in figures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across
the I/O pads or conductive paddle to adjacent I/O pads.
Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required fine stencil outline.
0.45
1.3
0.60
1.5
0.525
Solder Paste Stencil Aperture
0.55
0.35
0.45
1.1
0.60
1.1
0.475
6

6 Page









ACPM-5201 pdf, datenblatt
Storage Condition
Packages described in this document must be stored
in sealed moisture barrier, antistatic bags. Shelf life in a
sealed moisture barrier bag is 12 months at <40°C and
90% relative humidity (RH) J-STD-033 p.7.
Out-of-Bag Time Duration
After unpacking the device must be soldered to the PCB
within 168 hours as listed in the J-STD-020B p.11 with
factory conditions <30°C and 60% RH.
Baking
It is not necessary to re-bake the part if both conditions
(storage conditions and out-of bag conditions) have been
satisfied. Baking must be done if at least one of the con-
ditions above have not been satisfied. The baking condi-
tions are 125°C for 12 hours J-STD-033 p.8.
CAUTION
Tape and reel materials typically cannot be baked at the
temperature described above. If out-of-bag exposure
time is exceeded, parts must be baked for a longer time
at low temperatures, or the parts must be de-reeled,
de-taped, re-baked and then put back on tape and reel.
(See moisture sensitive warning label on each shipping
bag for information of baking).
Board Rework
Component Removal, Rework and Remount
If a component is to be removed from the board, it is
recommended that localized heating be used and the
maximum body temperatures of any surface mount
component on the board not exceed 200°C. This method
will minimize moisture related component damage. If any
component temperature exceeds 200°C, the board must
be baked dry per 4-2 prior to rework and/or component
removal. Component temperatures shall be measured at
the top center of the package body. Any SMD packages
that have not exceeded their floor life can be exposed to
a maximum body temperature as high as their specified
maximum reflow temperature.
Baking of Populated Boards
Some SMD packages and board materials are not able to
withstand long duration bakes at 125°C. Examples of this
are some FR-4 materials, which cannot withstand a 24 hr
bake at 125°C. Batteries and electrolytic capacitors are
also temperature sensitive. With component and board
temperature restrictions in mind, choose a bake tem-
perature from Table 4-1 in J-STD 033; then determine the
appropriate bake duration based on the component to
be removed. For additional considerations see IPC-7711
andIPC-7721.
Derating due to Factory Environmental Conditions
Factory floor life exposures for SMD packages removed
from the dry bags will be a function of the ambient envi-
ronmental conditions. A safe, yet conservative, handling
approach is to expose the SMD packages only up to the
maximum time limits for each moisture sensitivity level
as shown in next table. This approach, however, does not
work if the factory humidity or temperature is greater
than the testing conditions of 30°C/60% RH. A solution
for addressing this problem is to derate the exposure
times based on the knowledge of moisture diffusion in
the component package materials ref. JESD22-A120).
Recommended equivalent total floor life exposures can
be estimated for a range of humidities and temperatures
based on the nominal plastic thickness for each device.
Table on next page lists equivalent derated floor lives for
humidities ranging from 20-90% RH for three tempera-
ture, 20°C, 25°C, and 30°C.
Table on next page is applicable to SMDs molded
with novolac, biphenyl or multifunctional epoxy mold
compounds. The following assumptions were used in cal-
culating this table:
1. Activation Energy for diffusion = 0.35eV (smallest
known value).
2. For ≤60% RH, use Diffusivity = 0.121exp ( -0.35eV/kT)
mm2/s (this used smallest known Diffusivity @ 30°C).
3. For >60% RH, use Diffusivity = 1.320exp ( -0.35eV/kT)
mm2/s (this used largest known Diffusivity @ 30°C).
Removal for Failure Analysis
Not following the above requirements may cause
moisture/reflow damage that could hinder or com-
pletely prevent the determination of the original failure
mechanism.
12

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