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ADXL001 Schematic ( PDF Datasheet ) - Analog Devices

Teilenummer ADXL001
Beschreibung Wide Bandwidth Accelerometer
Hersteller Analog Devices
Logo Analog Devices Logo 




Gesamt 17 Seiten
ADXL001 Datasheet, Funktion
High Performance,
Wide Bandwidth Accelerometer
ADXL001
FEATURES
High performance accelerometer
±70 g, ±250 g, and ±500 g wideband ranges available
22 kHz resonant frequency structure
High linearity: 0.2% of full scale
Low noise: 4 mg/√Hz
Sensitive axis in the plane of the chip
Frequency response down to dc
Full differential signal processing
High resistance to EMI/RFI
Complete electromechanical self-test
Output ratiometric to supply
Velocity preservation during acceleration input overload
Low power consumption: 2.5 mA typical
8-terminal, hermetic ceramic, LCC package
APPLICATIONS
Using the Analog Devices, Inc. proprietary fifth-generation
iMEMs® process enables the ADXL001 to provide the desired
dynamic range that extends from ±70 g to ±500 g in combin-
ation with 22 kHz of bandwidth. The accelerometer output
channel passes through a wide bandwidth differential-to-single-
ended converter, which allows access to the full mechanical
performance of the sensor.
The part can operate on voltage supplies from 3.3 V to 5 V.
The ADXL001 also has a self-test (ST) pin that can be asserted to
verify the full electromechanical signal chain for the accelerometer
channel.
The ADXL001 is available in the industry-standard 8-terminal
LCC and is rated to work over the extended industrial temperature
range (−40°C to +125°C).
15
12
Vibration monitoring
Shock detection
Sports diagnostic equipment
Medical instrumentation
Industrial monitoring
GENERAL DESCRIPTION
9
6
3
0
–3
–6
The ADXL001 is a major advance over previous generations of
–9
accelerometers providing high performance and wide bandwidth.
This part is ideal for industrial, medical, and military applications
where wide bandwidth, small size, low power, and robust
performance are essential.
–12
–15
1
10 100 1k 10k
FREQUENCY (Hz)
Figure 1. Sensor Frequency Response
FUNCTIONAL BLOCK DIAGRAM
VS
100k
VDD
VDD2
TIMING
GENERATOR
ADXL001
MOD
DIFFERENTIAL
SENSOR
DEMOD
AMP
OUTPUT
AMPLIFIER
XOUT
SELF-TEST
ST COM
Figure 2.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.






ADXL001 Datasheet, Funktion
RECOMMENDED SOLDERING PROFILE
Table 3. Soldering Profile Parameters
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX), ts
TSMAX to TL
Ramp-Up Rate
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Liquidous Time (tL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C to Peak Temperature (tPEAK)
Sn63/Pb37
3°C/sec maximum
100°C
150°C
60 sec to 120 sec
3°C/sec
183°C
60 sec to 150 sec
240°C + 0°C/−5°C
10 sec to 30 sec
6°C/sec maximum
6 minute maximum
Soldering Profile Diagram
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
tPEAK
TIME (t)
Figure 3. Soldering Profile Diagram
ADXL001
Pb-Free
3°C/sec maximum
150°C
200°C
60 sec to 150 sec
3°C/sec
217°C
60 sec to 150 sec
260°C + 0°C/−5°C
20 sec to 40 sec
6°C/sec maximum
8 minute maximum
Rev. A | Page 5 of 16

6 Page









ADXL001 pdf, datenblatt
THEORY OF OPERATION
DESIGN PRINCIPLES
The ADXL001 accelerometer provides a fully differential sensor
structure and circuit path for excellent resistance to EMI/RFI
interference.
This latest generation SOI MEMS device takes advantage
of mechanically coupled but electrically isolated differential
sensing cells. This improves sensor performance and size
because a single proof mass generates the fully differential
signal. The sensor signal conditioning also uses electrical
feedback with zero-force feedback for improved accuracy
and stability. This force feedback cancels out the electrostatic
forces contributed by the sensor circuitry.
Figure 19 is a simplified view of one of the differential sensor
cell blocks. Each sensor block includes several differential
capacitor unit cells. Each cell is composed of fixed plates attached
to the device layer and movable plates attached to the sensor
frame. Displacement of the sensor frame changes the differential
capacitance. On-chip circuitry measures the capacitive change.
ADXL001
MECHANICAL SENSOR
The ADXL001 is built using the Analog Devices SOI MEMS
sensor process. The sensor device is micromachined in-plane
in the SOI device layer. Trench isolation is used to electrically
isolate, but mechanically couple, the differential sensing elements.
Single-crystal silicon springs suspend the structure over the
handle wafer and provide resistance against acceleration forces.
ANCHOR
PLATE
CAPACITORS
UNIT
SENSING
CELL
FIXED
PLATES
MOVABLE
FRAME
MOVING
PLATE
UNIT
FORCING
CELL
ANCHOR
Figure 19. Simplified View of Sensor Under Acceleration
Rev. A | Page 11 of 16

12 Page





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