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PDF AD8141 Data sheet ( Hoja de datos )
| Número de pieza | AD8141 | |
| Descripción | Triple Differential Drivers | |
| Fabricantes | Analog Devices | |
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Data Sheet
Low Cost, Triple Differential Drivers
for Wideband Video
AD8141/AD8142
FEATURES
Triple, high speed differential drivers
255 MHz, −3 dB large signal bandwidth
65 MHz, 0.1 dB flatness
1150 V/µs slew rate
12 ns settling time
Single 5 V or split supply operation
Fixed gain of 2
Internal common-mode feedback network
Output balance error −50 dB at 50 MHz
AD8142 has integrated sync-on-common-mode circuitry
High-Z output when disabled
Differential-to-differential or single-ended-to-differential
operation
High isolation between amplifiers: −100 dB at 10 MHz
Low power: 44 mA at 5 V
Available in space-saving packaging: 4 mm × 4 mm LFCSP
FUNCTIONAL BLOCK DIAGRAMS
DIS 1
VS–/GND 2
–IN A 3
+IN A 4
VS–/GND 5
–OUT A 6
24 23 22 21 20 19
+–
AD8141
–+
–+
18 VOCMC
17 VS+
16 –IN C
15 +IN C
14 VS–/GND
13 –OUT C
7 8 9 10 11 12
Figure 1.
APPLICATIONS
Keyboard-video-mouse (KVM) networking
Video distribution
Digital signage
Security cameras
GENERAL DESCRIPTION
The AD8141 and AD8142 are triple, low cost, differential or
single-ended-input-to-differential-output drivers. Each amplifier
has a fixed gain of 2 to compensate for the attenuation of the
line termination resistors. The AD8141 and AD8142 are
specifically designed for RGB signals but can be used for any
type of signals. The amplifiers have very fast slew rate and
settling time while being manufactured on a cost effective
CMOS process. They are optimized for high resolution video
performance with a 0.1 dB flatness of 65 MHz, which allows
driving high resolution video over any type of UTP cable.
The drivers have an internal common-mode feedback loop
that provides output amplitude and phase matching, achieving
−50 dB balance error at 50 MHz and thereby suppressing even-
order harmonics and minimizing radiated electromagnetic
interference (EMI).
24 23 22 21 20 19
AD8142
DIS 1
VS–/GND 2
–IN R 3
+IN R 4
VS–/GND 5
–OUT R 6
×2
+– –+ –+
18 SYNC LEVEL
17 VS+
16 –IN B
15 +IN B
14 VS–/GND
13 –OUT B
7 8 9 10 11 12
Figure 2.
The AD8142 includes a unique sync-on-common-mode feature
that allows the user to transmit balanced horizontal and vertical
video sync signals over the three common-mode channels.
Additionally, the AD8141 and AD8142 both have a disable
feature that, when asserted, produces high-Z outputs, allowing
line isolation and easy multiplexing.
The AD8141 and AD8142 are available in a 24-lead 4 mm × 4 mm
LFCSP and operate over a temperature range of −40°C to +85°C.
They can be used with the AD8145 triple differential-to-single-
ended receiver, AD8123 triple equalizer, AD8120 triple delay
line, and the AD8117 or AD8175 crosspoint switches to produce
a high resolution video distribution system.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevices for itsuse,nor foranyinfringementsofpatentsor other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2011–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
1 page  
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
HSYNC, VSYNC, SYNC LEVEL
Power Dissipation
Input Common-Mode Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Rating
5.5 V
VS−/VS+
See Figure 3
VS−/VS+
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for the device soldered in a circuit board in still air.
Table 3. Thermal Resistance with the Underside Pad
Thermally Connected to a Copper Plane
Package Type/PCB Type
θJA θJC Unit
24-Lead LFCSP/4-Layer
38 4.7 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the AD8141/AD8142
package is limited by the associated rise in junction temperature
(TJ) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the AD8141/AD8142. Exceeding
a junction temperature of 175°C for an extended period can result
in changes in the silicon devices potentially causing failure.
AD8141/AD8142
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). The load current consists of differential and
common-mode currents flowing to the loads, as well as currents
flowing through the internal differential and common-mode
feedback loops. The internal resistor tap used in the common-
mode feedback loop places a 12.5 kΩ differential load on the
output. RMS output voltages should be considered when
dealing with ac signals.
Airflow reduces θJA. In addition, more metal directly in contact
with the package leads from metal traces, through holes, ground,
and power planes reduce the θJA. The exposed pad on the underside
of the package must be soldered to a pad on the PCB surface that is
thermally connected to a PCB plane to achieve the specified θJA.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 24-lead LFCSP
(38°C/W) on a JEDEC standard 4-layer board with the underside
paddle soldered to a pad that is thermally connected to a PCB
plane. θJA values are approximations.
6
5
4
3
2
1
0
–40
–20
0
20 40 60 80
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. A | Page 5 of 24
5 Page 
Data Sheet
0.15
0.10
0.05
0
–0.05
–0.10
–0.15
0
5 10 15 20 25 30 35 40 45 50
TIME (ns)
Figure 24. Small Signal Transient Response, VOCM = 2.5 V (AD8141)
1.25
1.00
OUTPUT
10
8
0.75
0.50
INPUT
6
4
0.25 2
ERROR
00
–0.25
–0.50
0.1% SETTLED POINT
–2
–4
–0.75
–6
–1.00
–8
0.5% SETTLED POINT
–1.25
–10
–4 0 4 8 12 16 20 24 28 32 36
TIME (ns)
Figure 25. Differential Settling Time
58
RL, dm = OPEN CIRCUIT
56
54
52
AD8142
50
48
AD8141
46
44
42
40
38
–40
–20
0
20 40 60 80 100
TEMPERATURE (°C)
Figure 26. Positive Power Supply Current vs. Temperature
AD8141/AD8142
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
0
5 10 15 20 25 30 35 40 45 50
TIME (ns)
Figure 27. Large Signal Transient Response, VOCM = 2.5 V (AD8141)
7
6 VS+ = +2.5V
5 VS– = –2.5V
VOCM = 0V
4 SINGLE-ENDED DRIVE
3
2
1
0
–1
–2
–3
2× INPUT
–4 VOUT_DIFF
–5
–6
–7
0 100 200 300 400 500 600 700 800 900 1000
TIME (ns)
Figure 28. AD8141 Differential Overdrive Recovery
–35
RL, dm = OPEN CIRCUIT
–37
–39
–41
–43
AD8141
–45
AD8142
–47
–49
–51
–53
–40
–20
0
20 40 60 80 100
TEMPERATURE (°C)
Figure 29. Negative Power Supply Current vs. Temperature
Rev. A | Page 11 of 24
11 Page | ||
| Páginas | Total 24 Páginas | |
| PDF Descargar | [ Datasheet AD8141.PDF ] | |
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