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CHA2110-QDG Schematic ( PDF Datasheet ) - United Monolithic Semiconductors

Teilenummer CHA2110-QDG
Beschreibung 7-12 GHz LNA
Hersteller United Monolithic Semiconductors
Logo United Monolithic Semiconductors Logo 




Gesamt 10 Seiten
CHA2110-QDG Datasheet, Funktion
CHA2110-QDG
7-12 GHz LNA
GaAs Monolithic Microwave IC in SMD leadless package
Description
The CHA2110-QDG is a monolithic
two-stage wide band, self-biased Low Noise
Amplifier.
It is designed for a wide range of
applications, from military to commercial
communication systems.
The circuit is manufactured with a pHEMT
process, 0.25µm gate length, via holes
through the substrate, and air bridges.
It is supplied in RoHS compliant SMD
package.
UUMMSS
AA3261681780A
YYYYWWWWG
Main Features
Broadband performances: 7-12GHz
Linear gain: 19dB
Noise Figure: 1.2dB
Output power @ 1dB comp.: 10dBm
■ DC bias: Vd=4V @ Id=45mA
24L-QFN4x4
MSL1
25
20
S21
5.5
5.0
15 4.5
10 4.0
5 3.5
0 3.0
-5 S22
-10
S11
2.5
2.0
-15 1.5
-20 NF 1.0
-25 0.5
-30 0.0
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Frequency (GHz)
Typical gain, input return losses, output
return losses and Noise Figure (dB)
versus frequency
Main Electrical Characteristics
Tamb.= +25°C
Symbol
Parameter
Freq Frequency range
Gain Linear Gain
NF Noise Figure
Pout Output Power @1dB comp. (Freq.=10GHz)
Min Typ Max Unit
7 12 GHz
19 dB
1.2 dB
10 dBm
Ref. : DSCHA2110-QDG6159 - 07 Jun 16
1/10 Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34






CHA2110-QDG Datasheet, Funktion
CHA2110-QDG
Package outline (1)
7-12 GHz LNA
Matt tin, Lead Free
Units :
From the standard :
25-
(Green)
mm
JEDEC MO-220
(VGGD)
GND
1- Nc
2- Gnd(2)
3- Gnd(2)
4- RF in
5- Gnd(2)
6- Gnd(2)
7- 1A
8- 1B
9- Nc
10- 2A
11- 2B
12- Nc
13- Gnd(2)
14- Gnd(2)
15- RF out
16- Gnd(2)
17- Gnd(2)
18- Nc
19- Nc
20- Nc
21- VD2
22- VD1
23- Gnd(2)
24- Nc
(1) The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHA2110-QDG6159 - 07 Jun 16
6/10 Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

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