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GS8321V32GE Schematic ( PDF Datasheet ) - GSI Technology

Teilenummer GS8321V32GE
Beschreibung 36Mb Sync Burst SRAMs
Hersteller GSI Technology
Logo GSI Technology Logo 




Gesamt 30 Seiten
GS8321V32GE Datasheet, Funktion
GS8321V18/32/36E-250/225/200/166/150/133
165-Bump FP-BGA
Commercial Temp
Industrial Temp
2M x 18, 1M x 32, 1M x 36
36Mb Sync Burst SRAMs
250 MHz133 MHz
1.8 V VDD
1.8 V I/O
Features
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 1.8 V +10%/–10% core power supply
• 1.8 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 165-bump FP-BGA package
• Pb-Free 165-bump BGA package available
Functional Description
Applications
The GS8321V18/32/36E is a 37,748,736-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx,
BW, GW) are synchronous and are controlled by a positive-
edge-triggered clock input (CK). Output enable (G) and power
down control (ZZ) are asynchronous inputs. Burst cycles can
be initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
SCD Pipelined Reads
The GS8321V18/32/36E is a SCD (Single Cycle Deselect)
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)
versions are also available. SCD SRAMs pipeline deselect
commands one stage less than read commands. SCD RAMs
begin turning off their outputs immediately after the deselect
command has been captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS8321V18/32/36E operates on a 1.8 V power supply. All
input are 1.8 V compatible. Separate output power (VDDQ)
pins are used to decouple output noise from the internal circuits
and are 1.8 V compatible.
Parameter Synopsis
-250 -225 -200 -166 -150 -133 Unit
Pipeline
tKQ
tCycle
2.5 2.7 3.0 3.5 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.6 7.5 ns
3-1-1-1 Curr (x18) 285 265 245 220 210 185 mA
Curr (x32/x36) 350 320 295 260 240 215 mA
Flow
Through
2-1-1-1
tKQ
tCycle
Curr (x18)
Curr (x32/x36)
6.5
6.5
205
235
7.0
7.0
195
225
7.5
7.5
185
210
8.0
8.0
175
200
8.5
8.5
165
190
8.5
8.5
155
175
ns
ns
mA
mA
Rev: 1.03 4/2005
1/31
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology






GS8321V32GE Datasheet, Funktion
GS8321V18/32/36E-250/225/200/166/150/133
GS8321V18/32/36 Block Diagram
A0An
LBO
ADV
CK
ADSC
ADSP
GW
BW
BA
BB
BC
BD
Register
DQ
A0
A1
D0 Q0
D1 Q1
Counter
Load
A0
A1
Register
DQ
Register
DQ
Register
DQ
Register
DQ
Register
DQ
Register
E1 D Q
Register
DQ
FT
G
ZZ Power Down
Control
Note: Only x36 version shown for simplicity.
1
A
Memory
Array
Q
36
D
36
44
36
36
36
DQx1DQx9
36
36
4 32
Parity
Encode
4
Parity
Compare
NC NC
Rev: 1.03 4/2005
6/31
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

6 Page









GS8321V32GE pdf, datenblatt
GS8321V18/32/36E-250/225/200/166/150/133
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
VDDQ
VI/O
VIN
IIN
IOUT
PD
TSTG
TBIAS
Voltage on VDD Pins
Voltage in VDDQ Pins
Voltage on I/O Pins
Voltage on Other Input Pins
Input Current on Any Pin
Output Current on Any I/O Pin
Package Power Dissipation
Storage Temperature
Temperature Under Bias
0.5 to 3.6
0.5 to 3.6
0.5 to VDDQ +0.5 (3.6 V max.)
0.5 to VDD +0.5 (3.6 V max.)
+/20
+/20
1.5
55 to 125
55 to 125
V
V
V
V
mA
mA
W
oC
oC
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges
Parameter
Symbol Min. Typ. Max. Unit Notes
1.8 V Supply Voltage
VDD 1.6 1.8 2.0
V
1.8 V VDDQ I/O Supply Voltage
VDDQ
1.6
1.8
2.0
V
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be 2 V > Vi < VDDn+2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tKC.
Recommended Operating Temperatures
Parameter
Symbol Min. Typ. Max. Unit Notes
Ambient Temperature (Commercial Range Versions)
TA
0
25 70 °C
2
Ambient Temperature (Industrial Range Versions)
TA
40
25
85
°C
2
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be 2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.03 4/2005
12/31
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

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