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Teilenummer | PE35400 |
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Beschreibung | Divide-by-4 Prescaler | |
Hersteller | Peregrine Semiconductor | |
Logo | ||
Gesamt 13 Seiten PE35400
Document Category: Product Specification
UltraCMOS® Divide-by-4 Prescaler, 3–13.5 GHz
Features
• High frequency support up to 13.5 GHz
• Low SSB phase noise of –135 dBc/Hz @
3.025 GHz output frequency
• Low supply current of 16 mA
• Bare die
Applications
• Wireless communication
• Test and measurement
• Phased array radar
Figure 1 • PE35400 Functional Diagram
DQ
Q
DQ
Q
Product Description
The PE35400 is a high-performance UltraCMOS® prescaler with a fixed divide ratio of 4. It supports an operating
frequency range from 3–13.5 GHz. It operates on a single voltage supply with a frequency-selecting bias resistor
and draws a low current of 16 mA. The PE35400 is available in bare die.
The PE35400 is manufactured on Peregrine’s UltraCMOS process, a patented variation of silicon-on-insulator
(SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of
conventional CMOS.
©2015, Peregrine Semiconductor Corporation. All rights reserved. • Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121
Product Specification
www.psemi.com
DOC-64872-2 – (10/2015)
PE35400
Divide-by-4 Prescaler
Figure 4 • Input Power Sensitivity
Min PIN
Max PIN
10
5
0
Recommended input power
operating region
-5
-10
-15
-20
-25
1
RBIAS = 56 kΩ
2345
4.5 GHz
RBIAS = 5.6 kΩ
6 7 8 9 10 11 12 13 14 15
Input Frequency (GHz)
11.5 GHz
Figure 5 • Input Power Sensitivity vs Temperature
10
5
0
-5
-10
-15
-20
-25
1
Min PIN -40 °C
Max PIN -40 °C
Min PIN +25 °C
Max PIN +25 °C
Min PIN +85 °C
Max PIN +85 °C
RBIAS = 56 kΩ
RBIAS = 5.6 kΩ
2 3 4 5 6 7 8 9 10 11 12 13 14 15
4.5 GHz
Input Frequency (GHz) 11.5 GHz
Page 6
www.psemi.com
DOC-64872-2 – (10/2015)
6 Page PE35400
Divide-by-4 Prescaler
Waffle Pack Information
Figure 14 provides the waffle pack information for the PE35400.
Figure 14 • 2 × 2 Inch Waffle Pack for PE35400(1)(2)(3)
Notch
Pocket Closeup
Pad 1
Die ID
Notes:
1) Drawings are not drawn to scale.
2) Die in pocket shown pad side up.
3) Die will be oriented in the same direction in and within all waffle packs. Unless otherwise stated, die will be oriented such that the top left corner
of die will be in-line with the "notched" corner of the die plate base and corner. The die base cover label will be affixed on the die base cover
such that the top of the label indicates the top of the die within the waffle pack.
Page 12
www.psemi.com
DOC-64872-2 – (10/2015)
12 Page | ||
Seiten | Gesamt 13 Seiten | |
PDF Download | [ PE35400 Schematic.PDF ] |
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