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CBTL04082A Schematic ( PDF Datasheet ) - NXP Semiconductors

Teilenummer CBTL04082A
Beschreibung 2 : 1 multiplexer/demultiplexer switch
Hersteller NXP Semiconductors
Logo NXP Semiconductors Logo 




Gesamt 19 Seiten
CBTL04082A Datasheet, Funktion
CBTL04082A; CBTL04082B
3.3 V, 4 differential channel, 2 : 1 multiplexer/demultiplexer
switch for PCI Express Gen2
Rev. 1 — 28 February 2011
Product data sheet
1. General description
CBTL04082A/B is an 8-to-4 bidirectional differential channel multiplexer/demultiplexer
switch for PCI Express Generation 2 (Gen2) applications. The CBTL04082A/B can switch
four differential signals to one of two locations. Using a unique design technique, NXP has
minimized the impedance of the switch such that the attenuation observed through the
switch is negligible, and also minimized the channel-to-channel skew as well as
channel-to-channel crosstalk, as required by the high-speed serial interface.
CBTL04082A/B allows expansion of existing high speed ports for extremely low power.
The devices’ pinouts are optimized to match different application layouts. CBTL04082A
has input and output pins on the opposite of the package, and is suitable for edge
connector(s) with different signal sources on the motherboard. CBTL04082B has outputs
on both sides of the package, and the device can be placed between two connectors to
multiplex differential signals from a controller. Please refer to Section 8 for layout
examples.
2. Features and benefits
„ 4 bidirectional differential channel, 2 : 1 multiplexer/demultiplexer
„ High-speed signal switching for PCIe Gen2 5 Gbit/s
„ High bandwidth: 6 GHz at 3 dB
„ Insertion loss:
‹ 0.5 dB at 100 MHz
‹ 1.2 dB at 2.5 GHz
„ Low intra-pair skew: 5 ps typical
„ Low inter-pair skew: 35 ps maximum
„ Low crosstalk: 30 dB at 2.5 GHz
„ Low off-state isolation: 25 dB at 2.5 GHz
„ Low return loss: 20 dB at 2.5 GHz
„ VDD operating range: 3.3 V ± 10 %
„ Dual shutdown pins for channel 0/1 and 2/3 independently to minimize power
consumption
‹ Standby current less than 1 μA
„ ESD tolerance:
‹ 8 kV HBM
‹ 1 kV CDM
„ HVQFN42 package






CBTL04082A Datasheet, Funktion
NXP Semiconductors
CBTL04082A; CBTL04082B
3.3 V, 4 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
8. Application design-in information
CBTL04082A
PCI EXPRESS
CONTROLLER
CBTL04082B
Fig 3. A/B pinout difference (layout)
002aaf773
CBTL04082A_CBTL04082B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 February 2011
© NXP B.V. 2011. All rights reserved.
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CBTL04082A pdf, datenblatt
NXP Semiconductors
CBTL04082A; CBTL04082B
3.3 V, 4 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
CBTL04082A_CBTL04082B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 28 February 2011
© NXP B.V. 2011. All rights reserved.
12 of 18

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