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Número de pieza | CPC1788 | |
Descripción | Normally Open DC-Only Power Relay | |
Fabricantes | IXYS | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CPC1788 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! INTEGRATED CIRCUITS DIVISION
CPC1788
1000V Single-Pole, Normally Open
DC-Only Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, JC
Rating
1000
2.45
1
1.25
0.3
Units
VP
ADC
°C/W
Features
• 2.45ADC Load Current with 5°C/W Heat Sink
• Low 1.25 On-Resistance
• 1000VP Blocking Voltage
• 2500Vrms Input/Output Isolation
• Low Thermal Resistance: JC = 0.3 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
Pin Configuration
12
+-
34
-+
e3
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this new family, the CPC1788 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation, but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1788J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
IF
ILOAD
90%
ton
10%
toff
DS-CPC1788-R06
www.ixysic.com
1
1 page INTEGRATED CIRCUITS DIVISION
CPC1788
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
6
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=250mADC)
-20 0 20 40 60 80
Temperature (ºC)
Maximum Load Current
vs. Temperature
(With Heat Sink)
100
5 1ºC/W
4
5ºC/W
3
2 10ºC/W
Free Air
1
0
0 20 40 60 80 100
Temperature (ºC)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=Max Rated)
-20 0 20 40 60 80
Temperature (ºC)
100
Blocking Voltage vs. Temperature
1160
1140
1120
1100
1080
1060
1040
1020
1000
-40 -20
0 20 40 60
Temperature (ºC)
80 100
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
0
Typical Load Current
vs. Load Voltage
(IF=10mA)
0.1 0.2 0.3 0.4 0.5 0.6
Load Voltage (V)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=1000VP)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Energy Rating Curve
Free Air, No Heat Sink
15.0
13.5
12.0
10.5
9.0
7.5
6.0
4.5
3.0
1.5
0
10µs 100µs 1ms 10ms 100ms 1s 10s
Time
100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
www.ixysic.com
R06
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet CPC1788.PDF ] |
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