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PDF CPC1926Y Data sheet ( Hoja de datos )

Número de pieza CPC1926Y
Descripción Power SIP Relay
Fabricantes IXYS 
Logotipo IXYS Logotipo



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No Preview Available ! CPC1926Y Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
250
0.7
1.4
Units
VP
Arms / ADC
Features
Handle Load Currents Up to 0.7 ADC/Arms
2500Vrms Input/Output Isolation
Power SIP Package
High Reliability
No Moving Parts
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
IC Equipment
Home Appliances
CPC1926
Single-Pole, Normally Open
OptoMOS® Power SIP Relay
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability,
and compact size to a new family of high-power, solid
state relays. As part of that family, the CPC1926 is a
single-pole, normally open (1-Form-A) solid state relay.
The CPC1926 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED. The combination
of low on-resistance and high load-current handling
capabilities makes the relay suitable for a variety of
high-performance switching applications.
Approvals
UL 508 Certified Component: File E69938
Ordering Information
Part #
Description
CPC1926Y 4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
12
-+
3
4
Switching Characteristics
of Normally Open Devices
Pb
DS-CPC1926-R06
e3
Form-A
IF
ILOAD
www.ixysic.com
90%
ton
10%
toff
1

1 page




CPC1926Y pdf
INTEGRATED CIRCUITS DIVISION
CPC1926
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1926Y
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1926Y
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R06 www.ixysic.com
5

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