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RF7206 Schematic ( PDF Datasheet ) - RF Micro Devices

Teilenummer RF7206
Beschreibung 3V W-CDMA BAND 2 LINEAR PA MODULE
Hersteller RF Micro Devices
Logo RF Micro Devices Logo 




Gesamt 8 Seiten
RF7206 Datasheet, Funktion
RF7206
3V W-CDMA BAND 2 LINEAR PA MODULE
Package Style: Module, 10-Pin, 3mmx3mmx1.0mm
Features
HSDPA and HSPA+ Compliant
Low Voltage Positive Bias
Supply (3.0V to 4.35V)
+28.5dBm Linear Output
Power (+27.0dBm HSDPA
and HSPA+)
High Efficiency Operation
39% at POUT=+28.5dBm
19% at POUT=+19.0dBm
(Without DC/DC Converter)
Low Quiescent Current in Low
Power Mode: 17mA
Internal Voltage Regulator
Eliminates the Need for Exter-
nal Reference Voltage (VREF)
3-Mode Power States with
Digital Control Interface
Supports DC/DC Converter
Operation
Integrated Power Coupler
Integrated Blocking and Col-
lector Decoupling Capacitors
Applications
WCDMA/HSDPA/HSPA+
Wireless Handsets and Data
Cards
Dual-Mode UMTS Wireless
Handsets
Functional Block Diagram
Product Description
The RF7206 is a high-power, high-efficiency, linear power amplifier
designed for use as the final RF amplifier in 3V, 50W-CDMA mobile cel-
lular equipment and spread-spectrum systems. This PA is developed for
UMTS Band 2 which operates in the 1850MHz to 1910MHz frequency
band. The RF7206 has two digital control pins to select one of three
power modes to optimize performance and current drain at lower power
levels. The part also has an integrated directional coupler which elimi-
nates the need for an external discrete coupler at the output. The RF7206
is fully HSDPA and HSPA+-compliant and is assembled in a 10-pin,
3mmx3mm module.
Ordering Information
RF7206
3V W-CDMA Band 2 Linear PA Module
RF7206PCBA-410 Fully Assembled Evaluation Board
DS100805
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF7206 Datasheet, Funktion
RF7206
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
Figure 1. PCB Metal Land Pattern (Top View)
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS100805

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