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PDF PC3SD12NTZ Data sheet ( Hoja de datos )
| Número de pieza | PC3SD12NTZ | |
| Descripción | Phototriac Coupler | |
| Fabricantes | Sharp Microelectronics | |
| Logotipo |  |
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PC3SD12NTZ
Series
PC3SD12NTZ Series
VDRM : 600V, Cost effective
Non-zero cross type
DIP 6pin
Phototriac Coupler for triggering
■ Description
PC3SD12NTZ Series Phototriac Coupler include an
infrared emitting diode (IRED) optically coupled to an
output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
■ Features
1. High repetitive peak off-state voltage (VDRM : 600V)
2. Non-zero crossing functionality
3. 6 pin DIP package
4. Superior noise immunity (dV/dt : MIN. 1 000V/µs)
5. Double transfer mold construction (Ideal for Flow
Soldering)
6. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 3SD12)
2. Approved by CSA, file No. CA95323 (as model No.
3SD12)
3. Optionary available VDE Approved (∗)(DIN EN 60747-
5-2), file No. 40008189 (as model No. 3SD12)
4. Package resin : UL flammability grade (94V-0)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
Up to Date code "RD" (December 2003), approval of DIN
VDE0884.
From Date code "S1" (January 2004), approval of DIN
EN60747-5-2.
(∗∗) Reinforced insulation type is also available.
(PC3SF11YVZ Series)
■ Applications
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. Triggering for Triacs used for implementing phase
control in applications such as lighting control and
temperature control (HVAC).
3. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A07701FEN
1 Date Mar. 31. 2004
© SHARP Corporation
1 page  
■ Absolute Maximum Ratings
(Ta=25˚C)
Parameter
Symbol Rating
Unit
Forward current
Input
Reverse voltage
IF 50 mA
VR 6
V
RMS ON-state current
IT(rms)
Output Peak one cycle surge current Isurge
0.1
1.2 *3
A
A
Repetitive peak OFF-state voltage VDRM
*1Isolation voltage
Viso(rms)
600
5.0
V
kV
Operating temperature
Topr −30 to +100 ˚C
Storage temperature
*2Soldering temperature
Tstg −55 to +125 ˚C
Tsol
270 *4
˚C
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
PC3SD12NTZ Series
Soldering area
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Repentitive peak OFF-state current
ON-state voltage
Output Holding current
Critical rate of rise of OFF-state voltage
Transfer Minimum trigger current
charac- Isolation resistance
teristics Turn-on time
Rank A
Symbol
VF
IR
IDRM
VT
IH
dV/dt
IFT
RISO
ton
Conditions
IF=20mA
VR=3V
VD=VDRM
IT=0.1A
VD=V1/D√=−26·VVDRM
VD=6V, RL=100Ω
DC500V,40 to 60%RH
VD=6V, RL=100Ω, IF=20mA
MIN. TYP.
− 1.2
−−
−−
−−
0.1 −
1 000 2 000
−−
5×1010 1011
−−
(Ta=25˚C)
MAX. Unit
1.4 V
10 µA
1 µA
2.5 V
3.5 mA
− V/µs
10 mA
−Ω
50 µs
Sheet No.: D2-A07701FEN
5
5 Page 
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300 Terminal : 260˚C peak
( package surface : 250˚C peak)
PC3SD12NTZ Series
200
100 Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
0
0 1 2 3 4 (min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A07701FEN
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet PC3SD12NTZ.PDF ] | |
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