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PDF CHX2090RBF Data sheet ( Hoja de datos )

Número de pieza CHX2090RBF
Descripción 12-24GHz Frequency Multiplier
Fabricantes United Monolithic Semiconductors 
Logotipo United Monolithic Semiconductors Logotipo



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CHX2090RBF
12-24GHz Frequency Multiplier
GaAs Monolithic Microwave IC in SMD leadless package
Description
Main Features
The monolithic microwave IC (MMIC) in the
package is a cascadable by 2 frequency
multiplier. It is designed for a wide range of
applications, from military to commercial
communication systems. The circuit is
manufactured with a PM-HEMT process,
0.25µm gate length, via holes through the
substrate, air bridges and electron beam
gate lithography.
Broadband performances : 11-13GHz (f0)
Output power 13dBm (at 2f0) for
Pin = 12dBm (at f0)
Rejection better than 15dBc
(related to Pout at 2f0)
SMT leadless package
Dimensions: 5.08 x 5.08 x 0.97 mm3
It is supplied in a new SMT leadless chip
carrier.
SMT Package Dimensions
Please note that PIN 1 is located in the lower left corner of the package (front-side view) for all SMD-type packages from United Monolithic Semiconductors. It is indicated
by a triangle on the package lid. Starting with PIN 1 the other pads are numbered counter-clockwise (front-side view). ATTENTION: The dot on the backside of the
package (i.e. side with metallic pads) is just for fabrication purposes and does NOT indicate the location of PIN 1.
Ref. : DSCHX2090RBF2057 -26-Feb.02
1/6
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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CHX2090RBF pdf
12-24GHz Multiplier
CHX2090RBF
The RF ports comprise a DC blocking capacitor on chip level. The DC connections
include a first level of DC decoupling capacitors (typically 120pF) in the package.
However, all DC bias ports should be additionally connected to ground with 10nF
capacitors at board level to prevent the MMIC from oscillations. These parts should
be placed close to the SMD leadless package. If the same bias is required at
different DC ports, the lines should only be connected behind these block capacitors.
Further information on the application of the SMD leadless packages for GaAs
monolithic microwave ICs are given in the UMS Application Note AN0005.
Ref. : DSCHX2090RBF2057 -26-Feb.02
5/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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