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Número de pieza | CHM1290 | |
Descripción | 20-30GHz SUB-HARMONICALLY PUMPED MIXER | |
Fabricantes | United Monolithic Semiconductors | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CHM1290 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! CHM1290
20-30GHz SUB-HARMONICALLY PUMPED MIXER
GaAs Monolithic Microwave IC
Description
The CHM1290 is a MFC which integrates a self
biased LO buffer amplifier and a sub-
harmonically diodes mixer for 2LO suppression
It is usable both for up-conversion and down-
conversion. It is designed for a wide range of
applications,
typically
commercial
communication systems for broadband local
access (LMDS). The backside of the chip is both
RF and DC grounds. This helps simplify the
assembly process.
The circuit is manufactured with a PM-HEMT
process, 0.25µm gate length, capacities over via
holes, via holes through the substrate, air
bridges and electron beam gate lithography.
It is available in chip form.
Main Features
• Broadband performance : 20-30GHz
• 10dB conversion Loss
• 29dB 2LO to RF isolation
• -4dBm LO input power
• -3dBm input power 1 dB compression
• Low DC power consumption, [email protected]
• Chip size : 0.86 X 1.28 X 0.10 mm
Main Characteristics
Tamb. = 25°C
Parameter
Min Typ Max Unit
FRF RF frequency range
FLO LO frequency range
FIF IF frequency range
Lc Conversion Loss
20
10
DC
10
30 GHz
15 GHz
6 GHz
12 dB
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHM12902045 - 14-Feb.-02
1/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
1 page 20-30GHz SHP Mixer
Chip Assembly and Mechanical Data
CHM1290
Vd Voltage
RF
Input/Output bonding wires as
short as possible
10nF
120pF
IF
Input/Output DC coupled to
diodes
LO
Input/Output bonding wires as
short as possible
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
810 +/- 35
35
1280 +/- 35
860
760
260
140
35
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHM12902045 - 14-Feb.-02
5/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet CHM1290.PDF ] |
Número de pieza | Descripción | Fabricantes |
CHM1290 | 20-30GHz SUB-HARMONICALLY PUMPED MIXER | United Monolithic Semiconductors |
CHM1290-99F | 20-30GHz Sub-Harmonic Mixer | United Monolithic Semiconductors |
CHM1290REF | 20-30GHz SUB-HARMONICALLY PUMPED MIXER | United Monolithic Semiconductors |
CHM1291 | 25-32GHz Single Side Band Mixer | United Monolithic Semiconductors |
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