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CHF5KP30 Schematic ( Datenblatt PDF ) - Microsemi Corporation

Teilenummer CHF5KP30
Beschreibung Patented Flip Chip Series
Hersteller Microsemi Corporation
Logo Microsemi Corporation Logo 

Gesamt 3 Seiten
		
CHF5KP30 Datasheet, Funktion
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
FLIP CHIP TVS DIODES
CHF5KP5.0
thru
CHF5KP110CA
Patented Flip Chip Series
FEATURES
Unidirectional and bidirectional
Fully glass passivated
5000 watt (10/1000 µs)
Eliminates wire bonding
No overshoot
Provides optimum voltage clamping
MECHANICAL
Weight: 0.8 grams (approximate)
Cathode mark on top side
Metallization Cr - Ag - Au (Both Sides)
MAXIMUM RATINGS MECHANICAL
Max Junction Temperature: 1750C
Storage Temperature: -550C to +1750C
Flip Chip Peak Pulse Power: 5000 Watts (10/1000 µs)
Maximum non-repetitive peak power 5000 Watts
(10/1000 µs)
Total continuous power dissipation @ Tlead = 750C 10 W
Turn-on time (theoretical) unidirectional 1X10-12
Turn-on time (theoretical) bidirectional 1X10-9
PACKAGING
Waffle package
15 pieces per pack (STANDARD)
BIDIRECTIONAL ALL DIMENSIONS NOMINAL
FLIP CHIP DIMENSIONS
PAD SIZE & CIRCUIT
MSC0997.PDF
ISO 9001 CERTIFIED
REV H 8/18/99


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