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PDF EClamp2465T Data sheet ( Hoja de datos )
| Número de pieza | EClamp2465T | |
| Descripción | ESD/EMI Protection | |
| Fabricantes | Semtech | |
| Logotipo |  |
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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2465T is a combination EMI filter and line
termination device with integrated TVS diodes for use on
SIM Card interfaces on cellular phones and other por-
table electronics. This state-of-the-art device utilizes
solid-state silicon-avalanche technology for superior
clamping performance and DC electrical characteristics.
The device consists of three circuits that include series
impedance matching resistors for proper termination of
the SIM card interface. Termination resistor value of
100 Ohms is included on the Reset and Data lines and
47 Ohms on the CLK line. TVS diodes are also included
on each line for ESD protection in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4. An additional TVS diode connection is
included for protection of the voltage (Vcc) bus.
The EClamp2465T is in a 8-pin, RoHS/WEEE compliant,
SLP1713P8T package. It measures 1.7 x 1.3 mm with
a nominal height of only 0.4mm. The leads are spaced
at a pitch of 0.4mm and are finished with lead-free
NiPdAu. The small package makes it ideal for use in
portable electronics such as cell phones and digital still
cameras.
EClamp2465T
Low Capacitance
ESD/EMI Protection for SIM Card
PRELIMINARY
Features
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
TVS working voltage: 5V
Termination Resistors: 100 Ohms & 47 Ohms
Capacitance: 10pF (Typical at VR = 0V)
Protection and filtering for four lines
Solid-state technology
Mechanical Characteristics
SLP1713P8T 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.40 mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking: Marking Code + Date Code
Packaging: Tape and Reel
Applications
SIM Card
Cell Phone
PDAs and Smartphones
Pin Configuration
Package Configuration
Data to Connector 1
8 Data to IC
CLK to Connector
Reset to Connector
Gnd
CLK to IC
Reset to IC
NC 4
5 Vcc to Connector
1.70
12
1.30
0.40 BSC
0.40
Pin Identification and Configuration
(Top Side View)
Revision 09/24/2008
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com
1 page  
EClamp2465T
PROTECTION PRODUCTS
Device Connection
The EClamp2465T designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. Note that the ESD protection diodes are
located at pins 1 - 3 for the data and clock lines. This
means the device is directional. Therefore, Pins 1 - 3
must be routed to the SIM connector while pins 6 - 8
are routed to the protected IC. Pin 5 is routed to the
Vcc pin of the SIM connector. Typical layout examples
are shown in Figure 3. All path lengths should be kept
as short as possible to minimize the effects of parasitic
inductance in the board traces. The center tab should
be connected directly to the ground plane. Multiple
micro-vias are recommended in the device ground pad
as shown in Figure 2. Multiple vias in the device
ground pad will result in a lower inductive ground loop,
increasing the ESD effectiveness of the device.
PRELIMINARY
Figure 1 - Pin Identification and Configuration
(Top Side View)
Data to Connector 1
8 Data to IC
CLK to Connector
Reset to Connector
Gnd
CLK to IC
Reset to IC
NC 4
5 Vcc to Connector
Figure 2 - Recommended Layout Using Ground Vias
© 2008 Semtech Corp.
Figure 3 - SIM Protection Layout Examples
5
www.semtech.com
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| PDF Descargar | [ Datasheet EClamp2465T.PDF ] | |
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