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PDF EClamp2386P Data sheet ( Hoja de datos )
| Número de pieza | EClamp2386P | |
| Descripción | ESD/EMI Protection | |
| Fabricantes | Semtech | |
| Logotipo |  |
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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2386P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 200Ω and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4.
The EClamp2386P is in a 12-pin, RoHS/WEEE compli-
ant, SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Features
EClamp2386P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
TVS working voltage: 5V
Resistor: 200Ω +/− 15%
Total Capacitance: 12pF (VR = 2.5V)
Protection and filtering for six lines
Solid-state technology
Mechanical Characteristics
SLP3016P12 12-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
200 Ω
IN
OUT
12pF 12pF
GND
3.00
12
1.60
0.50 BSC
0.58
Device Schematic (6X)
Revision 1/25/2006
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com
1 page  
EClamp2386P
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller
diameter (such as 0.005 inches or 0.125mm) since
changing the diameter of the via will result in little
change in inductance (i.e. the log function in Equation 2
in highly insensitive to parameter d) . Figure 4 shows a
typical insertion loss (S21) plot for the device using
Semtech’s filter evaluation board with 50 Ohm traces
and the recommended via configuration.
Figure 3 - Recommended Layout Using Ground Vias
PRELIMINARY
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21 LOG 6 dB / REF 0 dB
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
START. 030 MHz
10
MHz
1: -12.260 dB
112 MHz
2: -35.300 dB
800 MHz
3: -34.405 dB
1.8 GHz
4: -30.362 dB
1
2.7 GHz
4
3
2
100
MHz
13
GHz GHz
STOP 3000.000000 MHz
2006 Semtech Corp.
5
www.semtech.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet EClamp2386P.PDF ] | |
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